In situ observation of the void formation-and-propagation mechanism in solder joints under current-stressing

Recent advances on electromigration in very-large-scale-integration of interconnects

K. N. Tu · Journal of Applied Physics · 2003 · 1.1K citations

Engineering, Electrical Engineering, Materials Science +17

Current-induced marker motion in gold wires

H. B. Huntington, A. Gröne · Journal of Physics and Chemistry of Solids · 1961 · 836 citations

Engineering, Electrical Engineering, Physics +13

Current-crowding-induced electromigration failure in flip chip solder joints

Everett C. C. Yeh, Woon‐Seop Choi, K. N. Tu et al. · Applied Physics Letters · 2002 · 363 citations

Engineering, Electrical Engineering, Materials Science +17

Thermomigration in Pb–Sn solder joints under joule heating during electric current stressing

Hua Ye, Cemal Basaran, Douglas C. Hopkins · Applied Physics Letters · 2003 · 243 citations

Engineering, Electrical Engineering, Materials Engineering +17

Mean-time-to-failure study of flip chip solder joints on Cu/Ni(V)/Al thin-film under-bump-metallization

Woon‐Seop Choi, Everett C. C. Yeh, K. N. Tu · Journal of Applied Physics · 2003 · 232 citations

Engineering, Electrical Engineering, Materials Science +17