Publication | Closed Access
Local melting induced by electromigration in flip-chip solder joints
60
Citations
17
References
2006
Year
Materials ScienceMaterials EngineeringElectromigration TechniqueEngineeringChip On BoardApplied PhysicsChip AttachmentElectronic PackagingMicroelectronicsLocal MeltingMicrostructure
| Year | Citations | |
|---|---|---|
Page 1
Page 1