Concepedia

Yi‐Shao Lai

YL

105

Publications

3.2K

Citations

31

H-Index

2002

Active since

Affiliations

Advanced Semiconductor Engineering (Taiwan)(Current)

National Cheng Kung University

I-Shou University

National Dong Hwa University

National Sun Yat-sen University

Yi‐Shao Lai is an author at Advanced Semiconductor Engineering (Taiwan) specializing in engineering, electronic packaging, and materials science.

Top concepts

EngineeringElectronic PackagingMaterial ScienceMicroelectronicsMechanical EngineeringElectrical EngineeringApplied PhysicsMechanics Of MaterialsMaterials EngineeringMicrostructure

Publications per year

2002–2016

105

Publications

105

Experimental studies of board-level reliability of chip-scale packages subjected to JEDEC drop test condition

Yi‐Shao Lai, Ping‐Feng Yang, Chang-Lin Yeh · Microelectronics Reliability · 2005 · 179 citations

Reliability, Reliability Engineering, Engineering +12

Nanoindentation identifications of mechanical properties of Cu6Sn5, Cu3Sn, and Ni3Sn4 intermetallic compounds derived by diffusion couples

Ping‐Feng Yang, Yi‐Shao Lai, Sheng‐Rui Jian et al. · Materials Science and Engineering A · 2007 · 161 citations

Materials Science, Engineering, Severe Plastic Deformation +11

Support excitation scheme for transient analysis of JEDEC board-level drop test

Chang-Lin Yeh, Yi‐Shao Lai · Microelectronics Reliability · 2005 · 88 citations

Electrical Engineering, Reliability Engineering, Engineering +4

Alloying modification of Sn–Ag–Cu solders by manganese and titanium

Li-Wei Lin, Jenn‐Ming Song, Yi‐Shao Lai et al. · Microelectronics Reliability · 2008 · 74 citations

Materials Engineering, Materials Science, Engineering +6

Electromigration of Sn–37Pb and Sn–3Ag–1.5Cu/Sn–3Ag–0.5Cu composite flip–chip solder bumps with Ti/Ni(V)/Cu under bump metallurgy

Yi‐Shao Lai, Kuo-Ming Chen, Chin-Li Kao et al. · Microelectronics Reliability · 2006 · 73 citations

Materials Science, Materials Engineering, Bump Metallurgy +6

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