Yi‐Shao Lai - Concepedia

Author

Yi‐Shao Lai

Advanced Semiconductor Engineering (Taiwan)

Also Known As

Yi-Shao Lai, Yi-shao Lai, Yishao Lai, Yi‐Shao Lai

238

Publications

3.7K

Citations

H-Index

103

Concepts

All Affiliations

Advanced Semiconductor Engineering (Taiwan)National Cheng Kung University I-Shou University National Dong Hwa University National Sun Yat-sen University

About

Yi‐Shao Lai is an author at Advanced Semiconductor Engineering (Taiwan) specializing in engineering, electronic packaging, and materials science.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	31	101	3K
2	Applied Physics	19	33	1.1K
3	Civil Engineering	3	3	49
4	Chemical Engineering	2	2	47
5	Chemistry	2	2	55

Yi‐Shao Lai

105

Publications

3.2K

Citations

H-Index

Page 1

	Year	Citations
Experimental studies of board-level reliability of chip-scale packages subjected to JEDEC drop test condition Yi‐Shao Lai, Ping‐Feng Yang, Chang-Lin Yeh Microelectronics Reliability ReliabilityReliability EngineeringEngineeringBoard-level ReliabilityChip-scale Package	2005	179
Nanoindentation identifications of mechanical properties of Cu6Sn5, Cu3Sn, and Ni3Sn4 intermetallic compounds derived by diffusion couples Ping‐Feng Yang, Yi‐Shao Lai, Sheng‐Rui Jian, Materials Science and Engineering A Materials ScienceEngineeringSevere Plastic DeformationMechanical PropertiesNanomaterials	2007	161
Support excitation scheme for transient analysis of JEDEC board-level drop test Chang-Lin Yeh, Yi‐Shao Lai Microelectronics Reliability Electrical EngineeringReliability EngineeringEngineeringTransient AnalysisInstrumentation	2005	88
Alloying modification of Sn–Ag–Cu solders by manganese and titanium Li-Wei Lin, Jenn‐Ming Song, Yi‐Shao Lai, Microelectronics Reliability Materials EngineeringMaterials ScienceEngineeringSn–ag–cu SoldersAlloy Design	2008	74
Electromigration of Sn–37Pb and Sn–3Ag–1.5Cu/Sn–3Ag–0.5Cu composite flip–chip solder bumps with Ti/Ni(V)/Cu under bump metallurgy Yi‐Shao Lai, Kuo-Ming Chen, Chin-Li Kao, Microelectronics Reliability Materials ScienceMaterials EngineeringBump MetallurgyElectromigration TechniqueEngineering	2006	73
Electromigration Reliability and Morphologies of Cu Pillar Flip-Chip Solder Joints with Cu Substrate Pad Metallization Yi‐Shao Lai, Ying-Ta Chiu, Jiunn Chen Journal of Electronic Materials Materials ScienceElectrical EngineeringElectromigration TechniqueEngineeringAdvanced Packaging (Semiconductors)	2008	72
Evaluation of board-level reliability of electronic packages under consecutive drops Chang-Lin Yeh, Yi‐Shao Lai, Chin‐Li Kao Microelectronics Reliability ReliabilityElectrical EngineeringReliability EngineeringEngineeringHardware Reliability	2005	68
Characteristics of ZnO thin films prepared by radio frequency magnetron sputtering Ping‐Feng Yang, Hua‐Chiang Wen, Sheng‐Rui Jian, Microelectronics Reliability Materials EngineeringMaterials ScienceEngineeringNanoelectronicsOxide Electronics	2007	64
Local melting induced by electromigration in flip-chip solder joints Cheng‐Hsien Tsai, Y. L. Lin, Jang‐Zern Tsai, Journal of Electronic Materials Materials ScienceMaterials EngineeringElectromigration TechniqueEngineeringChip On Board	2006	60
Characteristics of current crowding in flip-chip solder bumps Yi‐Shao Lai, Chin-Li Kao Microelectronics Reliability EngineeringAdvanced Packaging (Semiconductors)MicrofabricationFlip-chip Solder BumpsChip On Board	2005	59

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