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Electromigration Reliability and Morphologies of Cu Pillar Flip-Chip Solder Joints with Cu Substrate Pad Metallization

Materials ScienceElectrical EngineeringElectromigration TechniqueEngineeringAdvanced Packaging (Semiconductors)Chip On BoardChip AttachmentElectromigration ReliabilityElectronic PackagingMicroelectronicsInterconnect (Integrated Circuits)