Jiunn Chen

Nanoindentation identifications of mechanical properties of Cu6Sn5, Cu3Sn, and Ni3Sn4 intermetallic compounds derived by diffusion couples

Ping‐Feng Yang, Yi‐Shao Lai, Sheng‐Rui Jian et al. · Materials Science and Engineering A · 2007 · 161 citations

Materials Science, Engineering, Severe Plastic Deformation +11

Multipeak fitting analysis of Raman spectra on DLCH film

F. C. Tai, S. C. Lee, Jiunn Chen et al. · Journal of Raman Spectroscopy · 2009 · 118 citations

Diamond-like Carbon, Engineering, Natural Sciences +12

Electromigration Reliability and Morphologies of Cu Pillar Flip-Chip Solder Joints with Cu Substrate Pad Metallization

Yi‐Shao Lai, Ying-Ta Chiu, Jiunn Chen · Journal of Electronic Materials · 2008 · 72 citations

Materials Science, Electrical Engineering, Electromigration Technique +8

Spin-resolved photoemission studies of epitaxial Fe3O4(100) thin films

D. J. Huang, C. F. Chang, Jiunn Chen et al. · Journal of Magnetism and Magnetic Materials · 2002 · 62 citations

Materials Science, Spintronics, Ferromagnetism +7

Investigation of growth behavior of Al–Cu intermetallic compounds in Cu wire bonding

Jiunn Chen, Yi‐Shao Lai, Yi-Wun Wang et al. · Microelectronics Reliability · 2010 · 55 citations

Materials Science, Cu Wire Bonding, Materials Engineering +7