Ying-Ta Chiu - Concepedia

Author

Ying-Ta Chiu

Advanced Semiconductor Engineering (Taiwan)

Also Known As

Ying-Ta Chiu

Publications

588

Citations

H-Index

Concepts

All Affiliations

Advanced Semiconductor Engineering (Taiwan)National Dong Hwa University National Chung Hsing University National Cheng Kung University Indium Corporation (United States)

About

Ying-Ta Chiu is an author at Advanced Semiconductor Engineering (Taiwan) specializing in materials science, engineering, and electronic packaging.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	14	19	539
2	Applied Physics	11	12	288
3	Electrical Engineering	4	4	107
4	Chemistry	2	2	53
5	Computer Engineering	1	1	11

Ying-Ta Chiu

Publications

539

Citations

H-Index

Page 1

	Year	Citations
Alloying modification of Sn–Ag–Cu solders by manganese and titanium Li-Wei Lin, Jenn‐Ming Song, Yi‐Shao Lai, Microelectronics Reliability Materials EngineeringMaterials ScienceEngineeringSn–ag–cu SoldersAlloy Design	2008	74
Electromigration of Sn–37Pb and Sn–3Ag–1.5Cu/Sn–3Ag–0.5Cu composite flip–chip solder bumps with Ti/Ni(V)/Cu under bump metallurgy Yi‐Shao Lai, Kuo-Ming Chen, Chin-Li Kao, Microelectronics Reliability Materials ScienceMaterials EngineeringBump MetallurgyElectromigration TechniqueEngineering	2006	73
Electromigration Reliability and Morphologies of Cu Pillar Flip-Chip Solder Joints with Cu Substrate Pad Metallization Yi‐Shao Lai, Ying-Ta Chiu, Jiunn Chen Journal of Electronic Materials Materials ScienceElectrical EngineeringElectromigration TechniqueEngineeringAdvanced Packaging (Semiconductors)	2008	72
Strain Rate Dependence on Nanoindentation Responses of Interfacial Intermetallic Compounds in Electronic Solder Joints with Cu and Ag Substrates Jenn‐Ming Song, Yu-Lin Shen, Chien-Wei Su, MATERIALS TRANSACTIONS Crystal StructureEngineeringSevere Plastic DeformationMechanical EngineeringInterconnect (Integrated Circuits)	2009	40
Ball Impact Responses of Ni- or Ge-Doped Sn-Ag-Cu Solder Joints Yi‐Shao Lai, Jenn‐Ming Song, Hsiao‐Chuan Chang, Journal of Electronic Materials Materials ScienceMaterials EngineeringEngineeringApplied PhysicsBall Impact Responses	2007	31
Low-temperature Cu-to-Cu bonding using silver nanoparticles stabilised by saturated dodecanoic acid Wenhua Li, Pei-Syuan Lin, Chen-Ni Chen, Materials Science and Engineering A Materials ScienceEngineeringSaturated Dodecanoic AcidNanomaterialsNanotechnology	2014	31
The Pd distribution and Cu flow pattern of the Pd-plated Cu wire bond and their effect on the nanoindentation Yu‐Wei Lin, Ren-You Wang, Wun-Bin Ke, Materials Science and Engineering A Materials ScienceEngineeringNanomaterialsNanotechnologySurface Science	2012	24
Supersaturation induced by current stressing Ying-Ta Chiu, Chia‐Hao Liu, Kwang‐Lung Lin, Scripta Materialia Critical CurrentsSuperconducting MaterialEngineeringPhysicsStress	2011	22
Influence of trace alloying elements on the ball impact test reliability of SnAgCu solder joints Jenn‐Ming Song, Yao-Ren Liu, Yi‐Shao Lai, Microelectronics Reliability Materials ScienceEngineeringDurability PerformanceHardware ReliabilityPhysic Of Failure	2011	22
The influence of Pd on the interfacial reactions between the Pd-plated Cu ball bond and Al pad Yu‐Wei Lin, Wun-Bin Ke, Ren-You Wang, Surface and Coatings Technology Materials ScienceMaterials EngineeringInterfacial ReactionsEngineeringSurface Science	2012	22

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