Ying-Ta Chiu

Alloying modification of Sn–Ag–Cu solders by manganese and titanium

Li-Wei Lin, Jenn‐Ming Song, Yi‐Shao Lai et al. · Microelectronics Reliability · 2008 · 74 citations

Materials Engineering, Materials Science, Engineering +6

Electromigration of Sn–37Pb and Sn–3Ag–1.5Cu/Sn–3Ag–0.5Cu composite flip–chip solder bumps with Ti/Ni(V)/Cu under bump metallurgy

Yi‐Shao Lai, Kuo-Ming Chen, Chin-Li Kao et al. · Microelectronics Reliability · 2006 · 73 citations

Materials Science, Materials Engineering, Bump Metallurgy +6

Electromigration Reliability and Morphologies of Cu Pillar Flip-Chip Solder Joints with Cu Substrate Pad Metallization

Yi‐Shao Lai, Ying-Ta Chiu, Jiunn Chen · Journal of Electronic Materials · 2008 · 72 citations

Materials Science, Electrical Engineering, Electromigration Technique +8

Strain Rate Dependence on Nanoindentation Responses of Interfacial Intermetallic Compounds in Electronic Solder Joints with Cu and Ag Substrates

Jenn‐Ming Song, Yu-Lin Shen, Chien-Wei Su et al. · MATERIALS TRANSACTIONS · 2009 · 40 citations · Full text

Crystal Structure, Engineering, Severe Plastic Deformation +19

Ball Impact Responses of Ni- or Ge-Doped Sn-Ag-Cu Solder Joints

Yi‐Shao Lai, Jenn‐Ming Song, Hsiao‐Chuan Chang et al. · Journal of Electronic Materials · 2007 · 31 citations

Materials Science, Materials Engineering, Engineering +4