Chin-Li Kao - Concepedia

Author

Chin-Li Kao

Advanced Semiconductor Engineering (Taiwan)

Also Known As

C. L. Kao, C.-L. Kao, C.L. Kao, Chia-Yu Kao, Chia-ling Kao, Chin-Li Kao

Publications

598

Citations

H-Index

Concepts

All Affiliations

Advanced Semiconductor Engineering (Taiwan)National Cheng Kung University National Taiwan University

About

Chin-Li Kao is an author at Advanced Semiconductor Engineering (Taiwan) specializing in engineering, microelectronics, and electronic packaging.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	14	20	553
2	Applied Physics	11	12	352
3	Electrical Engineering	11	11	247
4	Computer Engineering	3	3	61
5	Chemical Engineering	1	1	20

Chin-Li Kao

Publications

565

Citations

H-Index

Page 1

	Year	Citations
Electromigration of Sn–37Pb and Sn–3Ag–1.5Cu/Sn–3Ag–0.5Cu composite flip–chip solder bumps with Ti/Ni(V)/Cu under bump metallurgy Yi‐Shao Lai, Kuo-Ming Chen, Chin-Li Kao, Microelectronics Reliability Materials ScienceMaterials EngineeringBump MetallurgyElectromigration TechniqueEngineering	2006	73
Characteristics of current crowding in flip-chip solder bumps Yi‐Shao Lai, Chin-Li Kao Microelectronics Reliability EngineeringAdvanced Packaging (Semiconductors)MicrofabricationFlip-chip Solder BumpsChip On Board	2005	59
<i>In situ</i> observation of thermomigration of Sn atoms to the hot end of 96.5Sn-3Ag-0.5Cu flip chip solder joints Fan-Yi Ouyang, Chin-Li Kao Journal of Applied Physics EngineeringHot EndDiffusion MarkersAdvanced Packaging (Semiconductors)Thermodynamics	2011	55
Electrothermal coupling analysis of current crowding and Joule heating in flip-chip packages Yi‐Shao Lai, Chin-Li Kao Microelectronics Reliability Electrical EngineeringEngineeringAdvanced Packaging (Semiconductors)Energy EfficiencyHeat Exchanger	2006	47
Inhibiting the detrimental Cu protrusion in Cu through-silicon-via by highly (111)-oriented nanotwinned Cu Ting-Chun Lin, Chien-Lung Liang, Shan-Bo Wang, Scripta Materialia Materials ScienceMaterials EngineeringEngineeringPhysicsNanomaterials	2021	33
Transient Simulation of Wire Pull Test on Cu/Low-K Wafers Chang-Lin Yeh, Yi‐Sheng Lai, Chin-Li Kao IEEE Transactions on Advanced Packaging EngineeringMechanical EngineeringResidual StressGold WiresStressstrain Analysis	2006	32
Highly uniform microfluidic electroless interconnections for chip stacking applications H. T. Hung, Zenghui Ma, Po‐Shao Shih, Electrochimica Acta Electrical EngineeringEngineeringMicrofabricationComputer EngineeringLab-on-a-chip	2021	31
Calibration of electromigration reliability of flip-chip packages by electrothermal coupling analysis Yi‐Shao Lai, Chin-Li Kao Journal of Electronic Materials Electrical EngineeringChip-scale PackageEngineeringAdvanced Packaging (Semiconductors)Electromigration Technique	2006	27
Athermal and thermal coupling electromigration effects on the microstructure and failure mechanism in advanced fine-pitch Cu interconnects under extremely high current density Chien-Lung Liang, Yung‐Sheng Lin, Chin-Li Kao, Materials Chemistry and Physics Materials EngineeringMaterials ScienceElectrical EngineeringElectromigration TechniqueEngineering	2020	24
Effects of bismuth additions on mechanical property and microstructure of SAC-Bi solder joint under current stressing Siou-Han Hu, Ting-Chun Lin, Chin-Li Kao, Microelectronics Reliability Materials EngineeringMaterials ScienceBismuth AdditionsEngineeringMechanical Engineering	2021	24

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