Chin-Li Kao

Electromigration of Sn–37Pb and Sn–3Ag–1.5Cu/Sn–3Ag–0.5Cu composite flip–chip solder bumps with Ti/Ni(V)/Cu under bump metallurgy

Yi‐Shao Lai, Kuo-Ming Chen, Chin-Li Kao et al. · Microelectronics Reliability · 2006 · 73 citations

Materials Science, Materials Engineering, Bump Metallurgy +6

Characteristics of current crowding in flip-chip solder bumps

Yi‐Shao Lai, Chin-Li Kao · Microelectronics Reliability · 2005 · 59 citations

Engineering, Advanced Packaging (Semiconductors), Microfabrication +5

<i>In situ</i> observation of thermomigration of Sn atoms to the hot end of 96.5Sn-3Ag-0.5Cu flip chip solder joints

Fan-Yi Ouyang, Chin-Li Kao · Journal of Applied Physics · 2011 · 55 citations

Engineering, Hot End, Diffusion Markers +18

Electrothermal coupling analysis of current crowding and Joule heating in flip-chip packages

Yi‐Shao Lai, Chin-Li Kao · Microelectronics Reliability · 2006 · 47 citations

Electrical Engineering, Engineering, Advanced Packaging (Semiconductors) +14

Inhibiting the detrimental Cu protrusion in Cu through-silicon-via by highly (111)-oriented nanotwinned Cu

Ting-Chun Lin, Chien-Lung Liang, Shan-Bo Wang et al. · Scripta Materialia · 2021 · 33 citations

Materials Science, Materials Engineering, Engineering +8