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Electrothermal coupling analysis of current crowding and Joule heating in flip-chip packages

Electrical EngineeringEngineeringAdvanced Packaging (Semiconductors)Energy EfficiencyHeat ExchangerCurrent CrowdingApplied PhysicsThermal ManagementChip AttachmentFlip-chip PackagesThermal ModelingThermodynamicsHeat TransferElectronic PackagingMicroelectronicsThermal EngineeringJoule Heating