Electromigration of Sn–37Pb and Sn–3Ag–1.5Cu/Sn–3Ag–0.5Cu composite flip–chip solder bumps with Ti/Ni(V)/Cu under bump metallurgy - Concepedia

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Electromigration of Sn–37Pb and Sn–3Ag–1.5Cu/Sn–3Ag–0.5Cu composite flip–chip solder bumps with Ti/Ni(V)/Cu under bump metallurgy

73

Citations

21

References

2006

Year

Yi‐Shao Lai, Kuo-Ming Chen, Chin-Li Kao, Chiu-Wen Lee, Ying-Ta Chiu

Microelectronics Reliability

Materials ScienceMaterials EngineeringBump MetallurgyElectromigration TechniqueEngineeringApplied PhysicsChip AttachmentElectronic PackagingMicroelectronics

References

	Year	Citations

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