Chien-Lung Liang - Concepedia

Author

Chien-Lung Liang

National Cheng Kung University ORCID

Also Known As

Chien-Lung Liang, Jiang-Long Liang, Sheng-Fu Yang

Publications

662

Citations

H-Index

Concepts

All Affiliations

National Cheng Kung University Advanced Semiconductor Engineering (Taiwan)National Central University

About

Chien-Lung Liang is an author at National Cheng Kung University specializing in engineering, materials science, and applied physics.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	14	16	393
2	Applied Physics	12	12	328
3	Materials Engineering	11	11	270
4	Electrical Engineering	7	7	195
5	Chemical Engineering	1	1	13

Chien-Lung Liang

Publications

432

Citations

H-Index

Page 1

	Year	Citations
A comprehensive study of electromigration in pure Sn: Effects on crystallinity, microstructure, and electrical property Yi‐Han Liao, Chang-Hsien Chen, Chien-Lung Liang, Acta Materialia Materials ScienceMaterials EngineeringElectrical EngineeringComprehensive StudyEngineering	2020	48
High dislocation density of tin induced by electric current Yi‐Han Liao, Chien-Lung Liang, Kwang‐Lung Lin, AIP Advances Materials EngineeringMaterials ScienceDislocation AggregatesDislocation LoopEngineering	2015	39
The mechanism of an increase in electrical resistance in Al thin film induced by current stressing Chien-Lung Liang, Ssu-Wei Lee, Kwang‐Lung Lin Thin Solid Films Materials ScienceElectrical ResistanceElectrical EngineeringAluminium NitrideEngineering	2017	34
Inhibiting the detrimental Cu protrusion in Cu through-silicon-via by highly (111)-oriented nanotwinned Cu Ting-Chun Lin, Chien-Lung Liang, Shan-Bo Wang, Scripta Materialia Materials ScienceMaterials EngineeringEngineeringPhysicsNanomaterials	2021	33
Electro-work hardening of metals induced by the athermal electromigration effect Chih-Chi Shu, Chien-Lung Liang, Kwang‐Lung Lin Materials Science and Engineering A Materials ScienceMaterials EngineeringElectro-work HardeningElectrometallurgyEngineering	2019	30
Electromigration Reliability of Advanced High-Density Fan-Out Packaging With Fine-Pitch 2-/2-<i>μ</i>m L/S Cu Redistribution Lines Chien-Lung Liang, Yung‐Sheng Lin, Chin‐Li Kao, IEEE Transactions on Components Packaging and Manufacturing Technology Advanced PackagingMaterials ScienceElectrical EngineeringCu RdlsEngineering	2020	29
Athermal and thermal coupling electromigration effects on the microstructure and failure mechanism in advanced fine-pitch Cu interconnects under extremely high current density Chien-Lung Liang, Yung‐Sheng Lin, Chin-Li Kao, Materials Chemistry and Physics Materials EngineeringMaterials ScienceElectrical EngineeringElectromigration TechniqueEngineering	2020	24
Non-equilibrium supersaturation behavior in a Cu/Sn/Cu interconnect induced by room temperature electromigration Chien-Lung Liang, Kwang‐Lung Lin Journal of Alloys and Compounds Electrical EngineeringElectromigration TechniqueEngineeringPhysicsNanoelectronics	2019	22
Electromigration Failure Study of a Fine-pitch 2μm/2μm L/S Cu Redistribution Line Embedded in Polyimide for Advanced High-density Fan-out Packaging Chien-Lung Liang, Yung‐Sheng Lin, Chin‐Li Kao, EngineeringIntegrated CircuitsCu Redistribution LineInterconnect (Integrated Circuits)Advanced Packaging (Semiconductors)	2020	21
Microstructural Evolution of Intermetallic Compounds in TCNCP Cu Pillar Solder Joints Chien-Lung Liang, Kwang‐Lung Lin, Jr-Wei Peng Journal of Electronic Materials Materials EngineeringMaterials ScienceIntermetallic CompoundsEngineeringSevere Plastic Deformation	2015	19

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