Kwang‐Lung Lin

Effect of microelements addition on the interfacial reaction between Sn-Ag-Cu solders and the Cu substrate

Chiang-Ming Chuang, Kwang‐Lung Lin · Journal of Electronic Materials · 2003 · 108 citations

Natural Sciences, Materials Engineering, Materials Science +17

High-Temperature Oxidation of a Sn-Zn-Al Solder

Kwang‐Lung Lin, Tzy-Ping Liu · Oxidation of Metals · 1998 · 101 citations

Natural Sciences, Materials Engineering, Materials Science +13

The interaction kinetics and compound formation between electroless NiP and solder

Chwan-Ying Lee Chwan-Ying Lee, Kwang‐Lung Lin · Thin Solid Films · 1994 · 98 citations

Natural Sciences, Materials Engineering, Materials Science +11

Electrochemical corrosion behaviour of Pb-free Sn–8.5Zn–0.05Al–XGa and Sn–3Ag–0.5Cu alloys in chloride containing aqueous solution

Udit Surya Mohanty, Kwang‐Lung Lin · Corrosion Science · 2008 · 80 citations

Natural Sciences, Materials Engineering, Materials Science +17

The microstructures of the Sn-Zn-Al solder alloys

Kwang‐Lung Lin, Li-Hsiang Wen, Tzy-Pin Liu · Journal of Electronic Materials · 1998 · 79 citations

Natural Sciences, Materials Engineering, Materials Science +12