Chiang-Ming Chuang

Effect of microelements addition on the interfacial reaction between Sn-Ag-Cu solders and the Cu substrate

Chiang-Ming Chuang, Kwang‐Lung Lin · Journal of Electronic Materials · 2003 · 108 citations

Materials Science, Materials Engineering, Sn-ag-cu Solders +11

Mechanical strength of Sn-3.5Ag-based solders and related bondings

Chiang-Ming Chuang, Po-Cheng Shih, Kwang‐Lung Lin · Journal of Electronic Materials · 2004 · 60 citations

Materials Science, Engineering, Mechanical Engineering +5

The interfacial reaction between Sn-Zn-Ag-Ga-Al solders and metallized Cu substrates

Chiang-Ming Chuang, Hui-Tzu Hung, Pei-Chi Liu et al. · Journal of Electronic Materials · 2004 · 13 citations

Materials Engineering, Materials Science, Interfacial Reaction +9

Interfacial reaction between Sn-Ag-Cu, Sn-Ag-Cu-Ni-Ge lead-free solders and metallic substrates

Chiang-Ming Chuang, Po-Cheng Shi, Kwang‐Lung Lin · 2003 · 10 citations

Materials Science, Materials Engineering, Chemical Engineering +15

Failure behavior upon shear test of 5Sn–95Pb solder bump after high temperature reliability test

Yeh-Hsiu Liu, Chiang-Ming Chuang, Kwang‐Lung Lin · Journal of materials research/Pratt's guide to venture capital sources · 2004 · 10 citations

Reliability, Engineering, Mechanical Engineering +6