Concepedia

Po-Cheng Shih

PS

Statistics

Publications

3

Citations

94

H-Index

3

Active since

2004

Affiliations

National Cheng Kung University(Current)

Po-Cheng Shih is an author at National Cheng Kung University specializing in electronic packaging, engineering, and materials science.

Top concepts

EngineeringMaterial ScienceElectronic PackagingMicrostructureApplied PhysicsSurface ScienceMaterials EngineeringMechanical Engineering

Publications per year

2004–2007

3

Publications

3

Mechanical strength of Sn-3.5Ag-based solders and related bondings

Chiang-Ming Chuang, Po-Cheng Shih, Kwang‐Lung Lin · Journal of Electronic Materials · 2004 · 60 citations

Materials Science, Engineering, Mechanical Engineering +5

IMC formation on BGA package with Sn–Ag–Cu and Sn–Ag–Cu–Ni–Ge solder balls

Kwang‐Lung Lin, Po-Cheng Shih · Journal of Alloys and Compounds · 2007 · 18 citations

Materials Science, Sn–ag–cu–ni–ge Solder Balls, Engineering +5

Interfacial Bonding Behavior with Introduction of Sn–Zn–Bi Paste to Sn–Ag–Cu Ball Grid Array Package During Multiple Reflows

Po-Cheng Shih, Kwang‐Lung Lin · Journal of materials research/Pratt's guide to venture capital sources · 2005 · 16 citations

Materials Science, Materials Engineering, Interfacial Bonding Behavior +8

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