Interfacial Bonding Behavior with Introduction of Sn–Zn–Bi Paste to Sn–Ag–Cu Ball Grid Array Package During Multiple Reflows

Six cases of reliability study of Pb-free solder joints in electronic packaging technology

Ke Zeng, K. N. Tu · Materials Science and Engineering R Reports · 2002 · 1.4K citations

Engineering, Materials Engineering, Materials Science +15

Effect of Cu concentration on the reactions between Sn-Ag-Cu solders and Ni

Cheng–En Ho, Rung‐Ywan Tsai, Y. L. Lin et al. · Journal of Electronic Materials · 2002 · 325 citations

Natural Sciences, Materials Engineering, Materials Science +13

Effects of fourth alloying additive on microstructures and tensile properties of Sn–Ag–Cu alloy and joints with Cu

K.S. Kim, Seok‐Hwan Huh, Katsuaki Suganuma · Microelectronics Reliability · 2003 · 290 citations

Natural Sciences, Materials Engineering, Materials Science +11

Mechanical characterization of Sn–Ag-based lead-free solders

Masazumi Amagai, Masako Watanabe, Masaki Omiya et al. · Microelectronics Reliability · 2002 · 240 citations

Natural Sciences, Materials Engineering, Materials Science +12

Effect of composition and cooling rate on microstructure and tensile properties of Sn–Zn–Bi alloys

Young‐Sun Kim, Keun‐Soo Kim, Chi-Won Hwang et al. · Journal of Alloys and Compounds · 2003 · 227 citations

Natural Sciences, Materials Engineering, Materials Science +10