Concepedia

Yeh-Hsiu Liu

YL

Statistics

Publications

2

Citations

53

H-Index

2

Active since

2004

Affiliations

National Cheng Kung University(Current)

Yeh-Hsiu Liu is an author at National Cheng Kung University specializing in mechanical engineering, engineering, and electronic packaging.

Top concepts

EngineeringMechanical EngineeringCorrosionReliabilityFailure AnalysisMaterial ScienceMicroelectronicsElectronic PackagingMaterials EngineeringMechanics Of Materials

Publications per year

2004–2005

2

Publications

2

Damages and Microstructural Variation of High-lead and Eutectic SnPb Composite Flip Chip Solder Bumps Induced by Electromigration

Yeh-Hsiu Liu, Kwang‐Lung Lin · Journal of materials research/Pratt's guide to venture capital sources · 2005 · 43 citations

Materials Science, Materials Engineering, Electromigration Technique +9

Failure behavior upon shear test of 5Sn–95Pb solder bump after high temperature reliability test

Yeh-Hsiu Liu, Chiang-Ming Chuang, Kwang‐Lung Lin · Journal of materials research/Pratt's guide to venture capital sources · 2004 · 10 citations

Reliability, Engineering, Mechanical Engineering +6

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