The interaction kinetics and compound formation between electroless NiP and solder

Kinetics of interfacial reaction in bimetallic CuSn thin films

K. N. Tu, R. D. Thompson · Acta Metallurgica · 1982 · 464 citations

Soldering in electronics

G.W.A.D. · Microelectronics Reliability · 1990 · 289 citations

Electrical Engineering, Engineering, Advanced Packaging (Semiconductors) +4

The Growth of Intermetallic Compounds on Common Basis Materials Coated with Tin and Tin-Lead Alloys

P. J. Kay, C.A. MacKay · Transactions of the IMF · 1976 · 148 citations

Engineering, Mechanical Engineering, Growth Rate Curves +17

Growth kinetics of intermetallic phases at the liquid Sn and solid Ni interface

S. K. Kang, V. Ramachandran · Scripta Metallurgica · 1980 · 125 citations

Materials Science, Interface Chemistry, Engineering +10

Phase formation by ion beam mixing in Ni/Al, Pd/Al, and Pt/Al bilayers

M. Nastasi, L. S. Hung, J. W. Mayer · Applied Physics Letters · 1983 · 96 citations

Aluminium Nitride, Engineering, Solid-state Chemistry +16