Electroless Plating
Electroless Plating is a chemical surface-engineering deposition process in which a metallic or alloy coating is deposited onto a substrate from an aqueous solution by autocatalytic chemical reduction of metal ions, without the application of external electrical current.
2.5K
Publications
92.4K
Citations
7.7K
Authors
1.4K
Institutions
Publications per year
2017–2026
474
Variants
Autocatalytic DepositionAutocatalytic PlatingChemical Plating
Parents
2.5K
1–5 of 2.5K
7.7K
23
h-index
21
h-index
16
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15
h-index
15
h-index
1–5 of 7.7K
1.4K

Chinese Academy of Sciences
Beijing, China
29 h-index
216 publications
10.9K citations
Waseda University
Tokyo, Japan
25 h-index
156 publications
5K citations
National Tsing Hua University
Hsinchu, Taiwan
23 h-index
136 publications
4.3K citations
National University of Singapore
Singapore, Singapore
23 h-index
106 publications
5.4K citations
Tokyo Institute of Technology
Tokyo, Japan
21 h-index
129 publications
4.4K citations
National Cheng Kung University
Tainan City, Taiwan
21 h-index
102 publications
4.2K citations

Centre National de la Recherche Scientifique
Paris, France
21 h-index
88 publications
3.7K citations

Harbin Institute of Technology
Harbin, China
21 h-index
134 publications
3.9K citations
1–8 of 1.4K
179 publications · 8.9K citations
56
h-index
JES · 282 publications · 9.6K citations
49
h-index
133 publications · 5.1K citations
43
h-index
60 publications · 2.6K citations
32
h-index
61 publications · 2.9K citations
32
h-index
1–5