Electroless Plating

Electroless Plating is a chemical surface-engineering deposition process in which a metallic or alloy coating is deposited onto a substrate from an aqueous solution by autocatalytic chemical reduction of metal ions, without the application of external electrical current.

2.5K

Publications

92.4K

Citations

7.7K

Authors

1.4K

Institutions

Publications per year

2017–2026

474

Publications

2.5K

Authors

7.7K

  1. TŌ
    Tetsuya Ōsaka

    Waseda University, Japan

    44 publications · 1.4K citations

    23

    h-index

  2. YS
    Yosi Shacham‐Diamand

    Tel Aviv University, Israel

    26 publications · 1.5K citations

    21

    h-index

  3. FM
    Falk Muench

    Technische Universität Darmstadt, Germany

    20 publications · 593 citations

    16

    h-index

  4. YO
    Y. Okinaka

    Waseda University, Japan

    18 publications · 771 citations

    15

    h-index

  5. WE
    Wolfgang Ensinger

    Technische Universität Darmstadt, Germany

    18 publications · 466 citations

    15

    h-index

1–5 of 7.7K

Venues

  1. Surface and Coatings Technology

    179 publications · 8.9K citations

    56

    h-index

  2. Journal of The Electrochemical Society

    JES · 282 publications · 9.6K citations

    49

    h-index

  3. Applied Surface Science

    133 publications · 5.1K citations

    43

    h-index

  4. Electrochimica Acta

    60 publications · 2.6K citations

    32

    h-index

  5. Journal of Alloys and Compounds

    61 publications · 2.9K citations

    32

    h-index

1–5