S. K. Kang

3D chip-stacking technology with through-silicon vias and low-volume lead-free interconnections

Katsuyuki Sakuma, Paul Andry, Cornelia Tsang et al. · IBM Journal of Research and Development · 2008 · 163 citations

Engineering, Manufacturing Engineering, Manufacturing Processes +16

Interfacial reactions during soldering with lead-tin eutectic and lead (Pb)-free, tin-rich solders

S. K. Kang, S. Purushothaman · Journal of Electronic Materials · 1996 · 162 citations

Natural Sciences, Materials Engineering, Materials Science +12

Microstructure and mechanical properties of lead-free solders and solder joints used in microelectronic applications

S. K. Kang, Paul Lauro, Da‐Yuan Shih et al. · IBM Journal of Research and Development · 2005 · 149 citations

Natural Sciences, Materials Engineering, Materials Science +14

Growth kinetics of intermetallic phases at the liquid Sn and solid Ni interface

S. K. Kang, V. Ramachandran · Scripta Metallurgica · 1980 · 127 citations

Natural Sciences, Materials Engineering, Materials Science +17

Spalling of intermetallic compounds during the reaction between lead-free solders and electroless Ni-P metallization

Yoonchul Sohn, Jin Yu, S. K. Kang et al. · Journal of materials research/Pratt's guide to venture capital sources · 2004 · 95 citations

Engineering, Materials Engineering, Materials Science +12