Concepedia

Yoonchul Sohn

YS

15

Publications

600

Citations

12

H-Index

2003

Active since

Affiliations

Samsung (South Korea)(Current)

Korea Advanced Institute of Science and Technology

Chosun University

IBM Research - Thomas J. Watson Research Center

IBM (United States)

Yoonchul Sohn is an author at Samsung (South Korea) specializing in engineering, materials science, and applied physics.

ORCID

Top concepts

Publications per year

2003–2022

15

Publications

15

A comparative study of Cn/Sn/Cu and Ni/Sn/Ni solder joints for low temperature stable transient liquid phase bonding

Kunmo Chu, Yoonchul Sohn, Changyoul Moon · Scripta Materialia · 2015 · 116 citations

, , +4

Electrical and Thermal Properties of Carbon-Nanotube Composite for Flexible Electric Heating-Unit Applications

Kunmo Chu, Dongouk Kim, Yoonchul Sohn et al. · IEEE Electron Device Letters · 2013 · 98 citations

, , +22

Spalling of intermetallic compounds during the reaction between lead-free solders and electroless Ni-P metallization

Yoonchul Sohn, Jin Yu, S. K. Kang et al. · Journal of materials research/Pratt's guide to venture capital sources · 2004 · 95 citations

, , +12

Effect of Cu content on the mechanical reliability of Ni/Sn–3.5Ag system

Ju Yeong Kim, Yoonchul Sohn, Jin Yu · Journal of materials research/Pratt's guide to venture capital sources · 2007 · 59 citations

, , +6

Correlation Between Chemical Reaction and Brittle Fracture Found in Electroless Ni(P)/immersion gold–solder Interconnection

Yoonchul Sohn, Jin Yu · Journal of materials research/Pratt's guide to venture capital sources · 2005 · 48 citations

, , +7

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