Chien-Wei Su

Strain Rate Dependence on Nanoindentation Responses of Interfacial Intermetallic Compounds in Electronic Solder Joints with Cu and Ag Substrates

Jenn‐Ming Song, Yu-Lin Shen, Chien-Wei Su et al. · MATERIALS TRANSACTIONS · 2009 · 40 citations · Full text

Crystal Structure, Engineering, Severe Plastic Deformation +19

Time-dependent deformation behavior of interfacial intermetallic compound layers in electronic solder joints

Jenn‐Ming Song, Chien-Wei Su, Yi‐Shao Lai et al. · Journal of materials research/Pratt's guide to venture capital sources · 2010 · 17 citations

Materials Science, Friction Welding, Engineering +10

Mechanical Responses of Superlight β-Based Mg-Li-Al-Zn Wrought Alloys under Resonance

Jenn‐Ming Song, Yihua Lin, Chien-Wei Su et al. · Metallurgical and Materials Transactions A · 2009 · 16 citations

Materials Science, Materials Engineering, Engineering +7

Intermetallic formation induced substrate dissolution in electroless Ni(P)-solder interconnections

Jenn‐Ming Song, Yao-Ren Liu, Chien-Wei Su et al. · Journal of materials research/Pratt's guide to venture capital sources · 2008 · 13 citations

Materials Science, Electromigration Technique, Engineering +5