Statistics
Publications
2
Citations
35
H-Index
2
Active since
2008
Affiliations
Yao-Ren Liu is an author at National Dong Hwa University specializing in electronic packaging, materials science, and engineering.
Publications per year
2008–2011
2
2
Intermetallic formation induced substrate dissolution in electroless Ni(P)-solder interconnections
Jenn‐Ming Song, Yao-Ren Liu, Chien-Wei Su et al. · Journal of materials research/Pratt's guide to venture capital sources · 2008 · 13 citations
Materials Science, Electromigration Technique, Engineering +5
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