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Influence of trace alloying elements on the ball impact test reliability of SnAgCu solder joints

Materials ScienceEngineeringDurability PerformanceHardware ReliabilityPhysic Of FailureMechanical EngineeringEngineering Failure AnalysisSolid MechanicsElectronic PackagingSnagcu Solder JointsHigh-performance MetalMechanics Of MaterialsMicrostructure