Low-temperature Cu-to-Cu bonding using silver nanoparticles stabilised by saturated dodecanoic acid

Wenhua Li, Pei-Syuan Lin, Chen-Ni Chen, Teng‐Yuan Dong, Chi‐Hang Tsai, Wan-Ting Kung, Jenn‐Ming Song, Ying-Ta Chiu, Ping‐Feng Yang

Materials Science and Engineering A · 2014 · 32 citations · 43 references

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