Ping‐Feng Yang

Experimental studies of board-level reliability of chip-scale packages subjected to JEDEC drop test condition

Yi‐Shao Lai, Ping‐Feng Yang, Chang-Lin Yeh · Microelectronics Reliability · 2005 · 180 citations

Engineering, Computer Engineering, Packaging Design +14

Nanoindentation identifications of mechanical properties of Cu6Sn5, Cu3Sn, and Ni3Sn4 intermetallic compounds derived by diffusion couples

Ping‐Feng Yang, Yi‐Shao Lai, Sheng‐Rui Jian et al. · Materials Science and Engineering A · 2007 · 163 citations

Natural Sciences, Materials Engineering, Materials Science +15

An Overview of the Development of a GPU with Integrated HBM on Silicon Interposer

Chang-Chi Lee, C.-P Hung, Calvin Cheung et al. · 2016 · 134 citations

Engineering, Computer Engineering, Electrical Engineering +17

Selective maltose hydrogenation to maltitol on a ternary Co–P–B amorphous catalyst and the synergistic effects of alloying B and P

Hui Li, Ping‐Feng Yang, Dongsheng Chu et al. · Applied Catalysis A General · 2007 · 92 citations

Natural Sciences, Chemical Engineering, Chemistry +11

Wafer Warpage Experiments and Simulation for Fan-Out Chip on Substrate

Yuan-Ting Lin, Wei‐Hong Lai, Chin‐Li Kao et al. · 2016 · 88 citations

Engineering, Computer Engineering, Computer-integrated Manufacturing +13