Chang-Lin Yeh

Publications

1.3K

Citations

H-Index

2004

Active since

Affiliations

Advanced Semiconductor Engineering (Taiwan)(Current)

Institute of Microelectronics

NXP (Netherlands)

Philips (Netherlands)

National Cheng Kung University

Chang-Lin Yeh is an author at Advanced Semiconductor Engineering (Taiwan) specializing in engineering, mechanical engineering, and electronic packaging.

Top concepts

EngineeringElectronic PackagingMechanical EngineeringMechanics Of MaterialsStructural MechanicsSolid MechanicsReliability EngineeringElectrical EngineeringMicroelectronicsReliability

Publications per year

2004–2010

Publications

Experimental studies of board-level reliability of chip-scale packages subjected to JEDEC drop test condition

Yi‐Shao Lai, Ping‐Feng Yang, Chang-Lin Yeh · Microelectronics Reliability · 2005 · 179 citations

Reliability, Reliability Engineering, Engineering +12

Support excitation scheme for transient analysis of JEDEC board-level drop test

Chang-Lin Yeh, Yi‐Shao Lai · Microelectronics Reliability · 2005 · 88 citations

Electrical Engineering, Reliability Engineering, Engineering +4

Stress–Strain Characteristics of Tin-Based Solder Alloys for Drop-Impact Modeling

E.H. Wong, Cheryl Selvanayagam, S.K.W. Seah et al. · Journal of Electronic Materials · 2008 · 79 citations

Materials Science, Engineering, Mechanical Engineering +5

Evaluation of board-level reliability of electronic packages under consecutive drops

Chang-Lin Yeh, Yi‐Shao Lai, Chin‐Li Kao · Microelectronics Reliability · 2005 · 68 citations

Reliability, Electrical Engineering, Reliability Engineering +10

Evaluation of solder joint strengths under ball impact test

Yi‐Shao Lai, Hsiao‐Chuan Chang, Chang-Lin Yeh · Microelectronics Reliability · 2007 · 57 citations

Engineering, Impact (Mechanics), Strength Property +5

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