Chang-Lin Yeh - Concepedia

Author

Chang-Lin Yeh

Advanced Semiconductor Engineering (Taiwan)

Also Known As

C.-L. Yeh, Chang-Lin Yeh, Chang-lin Yeh

Publications

1.4K

Citations

H-Index

Concepts

All Affiliations

Advanced Semiconductor Engineering (Taiwan)Institute of Microelectronics NXP (Netherlands)Philips (Netherlands)National Cheng Kung University

About

Chang-Lin Yeh is an author at Advanced Semiconductor Engineering (Taiwan) specializing in engineering, mechanical engineering, and electronic packaging.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	23	35	1.3K
2	Electrical Engineering	12	13	420
3	Computer Engineering	10	10	434
4	Applied Physics	3	3	81
5	Civil Engineering	2	2	28

Chang-Lin Yeh

Publications

1.3K

Citations

H-Index

Page 1

	Year	Citations
Experimental studies of board-level reliability of chip-scale packages subjected to JEDEC drop test condition Yi‐Shao Lai, Ping‐Feng Yang, Chang-Lin Yeh Microelectronics Reliability ReliabilityReliability EngineeringEngineeringBoard-level ReliabilityChip-scale Package	2005	179
Support excitation scheme for transient analysis of JEDEC board-level drop test Chang-Lin Yeh, Yi‐Shao Lai Microelectronics Reliability Electrical EngineeringReliability EngineeringEngineeringTransient AnalysisInstrumentation	2005	88
Stress–Strain Characteristics of Tin-Based Solder Alloys for Drop-Impact Modeling E.H. Wong, Cheryl Selvanayagam, S.K.W. Seah, Journal of Electronic Materials Materials ScienceEngineeringMechanical EngineeringStressstrain AnalysisStress–strain Characteristics	2008	79
Evaluation of board-level reliability of electronic packages under consecutive drops Chang-Lin Yeh, Yi‐Shao Lai, Chin‐Li Kao Microelectronics Reliability ReliabilityElectrical EngineeringReliability EngineeringEngineeringHardware Reliability	2005	68
Evaluation of solder joint strengths under ball impact test Yi‐Shao Lai, Hsiao‐Chuan Chang, Chang-Lin Yeh Microelectronics Reliability EngineeringImpact (Mechanics)Strength PropertyImpact LoadingMechanical Engineering	2007	57
Transient fracturing of solder joints subjected to displacement-controlled impact loads Chang-Lin Yeh, Yi‐Shao Lai Microelectronics Reliability Damage MechanismEngineeringImpact (Mechanics)MechanicsImpact Loading	2005	44
Effects of different drop test conditions on board-level reliability of chip-scale packages Yi‐Shao Lai, Po‐Chuan Yang, Chang-Lin Yeh Microelectronics Reliability ReliabilityReliability EngineeringEngineeringBoard-level ReliabilityChip-scale Package	2007	43
Effects of solder alloy constitutive relationships on impact force responses of package-level solder joints under ball impact test Chang-Lin Yeh, Yi‐Shao Lai Journal of Electronic Materials Ball Impact TestEngineeringImpact (Mechanics)Strength PropertyImpact Loading	2006	43
Empirical correlation between package-level ball impact test and board-level drop reliability Chang-Lin Yeh, Yi‐Shao Lai, Hsiao‐Chuan Chang, Microelectronics Reliability ReliabilityBoard-level Drop ReliabilityReliability EngineeringEngineeringImpact (Mechanics)	2006	42
Stress–strain characteristics of tin-based solder alloys at medium strain rate E.H. Wong, Cheryl Selvanayagam, S.K.W. Seah, Materials Letters Materials ScienceMedium Strain RateEngineeringMechanical PropertiesMechanical Engineering	2008	40

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