Hsiao‐Chuan Chang

Evaluation of solder joint strengths under ball impact test

Yi‐Shao Lai, Hsiao‐Chuan Chang, Chang-Lin Yeh · Microelectronics Reliability · 2007 · 57 citations

Engineering, Materials Engineering, Materials Science +13

Empirical correlation between package-level ball impact test and board-level drop reliability

Chang-Lin Yeh, Yi‐Shao Lai, Hsiao‐Chuan Chang et al. · Microelectronics Reliability · 2006 · 42 citations

Engineering, Systems Engineering, Impact Measurement +12

Ball Impact Responses of Ni- or Ge-Doped Sn-Ag-Cu Solder Joints

Yi‐Shao Lai, Jenn‐Ming Song, Hsiao‐Chuan Chang et al. · Journal of Electronic Materials · 2007 · 31 citations

Natural Sciences, Materials Engineering, Materials Science +12

Correlation Between Package-level Ball Impact Test and Board-level Drop Test

Chang-Lin Yeh, Yi‐Shao Lai, Hsiao‐Chuan Chang et al. · 2006 · 22 citations

Natural Sciences, Materials Engineering, Materials Science +14

Characterizations of ball impact responses of wafer-level chip-scale packages

Yi‐Shao Lai, Chang-Lin Yeh, Hsiao‐Chuan Chang et al. · Journal of Alloys and Compounds · 2006 · 12 citations

Engineering, Materials Engineering, Mechanical Behavior Of Materials +13