Hsiao‐Chuan Chang

Statistics

Publications

Citations

175

H-Index

Active since

2006

Affiliations

Advanced Semiconductor Engineering (Taiwan)(Current)

Hsiao‐Chuan Chang is an author at Advanced Semiconductor Engineering (Taiwan) specializing in engineering, mechanical engineering, and electronic packaging.

Top concepts

EngineeringMechanical EngineeringElectronic PackagingReliabilitySoftware TestingMicrostructureApplied PhysicsFailure AnalysisMaterial ScienceMicroelectronics

Publications per year

2006–2014

Publications

Evaluation of solder joint strengths under ball impact test

Yi‐Shao Lai, Hsiao‐Chuan Chang, Chang-Lin Yeh · Microelectronics Reliability · 2007 · 57 citations

Engineering, Impact (Mechanics), Strength Property +5

Empirical correlation between package-level ball impact test and board-level drop reliability

Chang-Lin Yeh, Yi‐Shao Lai, Hsiao‐Chuan Chang et al. · Microelectronics Reliability · 2006 · 42 citations

Reliability, Board-level Drop Reliability, Reliability Engineering +9

Ball Impact Responses of Ni- or Ge-Doped Sn-Ag-Cu Solder Joints

Yi‐Shao Lai, Jenn‐Ming Song, Hsiao‐Chuan Chang et al. · Journal of Electronic Materials · 2007 · 31 citations

Materials Science, Materials Engineering, Engineering +4

Correlation Between Package-level Ball Impact Test and Board-level Drop Test

Chang-Lin Yeh, Yi‐Shao Lai, Hsiao‐Chuan Chang et al. · 2006 · 22 citations

Reliability, Chip-scale Package, Engineering +11

Characterizations of ball impact responses of wafer-level chip-scale packages

Yi‐Shao Lai, Chang-Lin Yeh, Hsiao‐Chuan Chang et al. · Journal of Alloys and Compounds · 2006 · 12 citations

Chip-scale Package, Engineering, Advanced Packaging (Semiconductors) +6

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