Concepedia

Stress–Strain Characteristics of Tin-Based Solder Alloys for Drop-Impact Modeling

E.H. Wong, Cheryl Selvanayagam, S.K.W. Seah, W.D. van Driel, J.F.J.M. Caers, Xiujuan Zhao, N. Owens, L.C. Tan, D. R. Frear, M. Leoni,

Journal of Electronic Materials · 2008 · 79 citations · 7 references

DOI

Concepts

References

7

Review of experimental techniques for high rate deformation and shock studies

J. E. Field, S. M. Walley, William G. Proud et al. · International Journal of Impact Engineering · 2004 · 787 citations

, , +15

Mechanical properties of SnPb and lead-free solders at high rates of strain

Clive R. Siviour, S. M. Walley, William G. Proud et al. · Journal of Physics D Applied Physics · 2005 · 87 citations

, , +11

Drop Impact: Fundamentals and Impact Characterisation of Solder Joints

E.H. Wong, R. Rajoo, S.K.W. Seah et al. · 2005 · 84 citations

, , +17

Comparison of low-melting lead-free solders in tensile properties with Sn–Pb eutectic solder

Ikuo Shohji, Tomohiro Yoshida, Takehiko Takahashi et al. · Journal of Materials Science Materials in Electronics · 2004 · 38 citations

, , +13

Dynamic plastic behavior of 63 wt% Sn 37 wt% Pb eutectic solder under high strain rates

B. Wang, Sung Yi · Journal of Materials Science Letters · 2002 · 29 citations

, , +14