EngineeringMaterials EngineeringMaterials ScienceElectronic MaterialsMechanical Behavior Of MaterialsMetallurgyDamage MechanicsFracture MechanicsFracture ToughnessImpact BehaviorImpact DynamicsImpact MechanicsDrop Impact AnalysisDrop TestingFracture EnergyImpact DamageImpact Damage MechanicsImpact Fracture AnalysisMaterial Failure Under ImpactSolder Joint Strength
This paper presents a summary of the fundamental theories behind board level drop impact covering the dynamics of drop impact assembly, dynamics of PCB, as well as interconnection stress. This is followed by a comprehensive study of the fracture characteristics of solder interconnections under high-speed impact using a newly developed Micro Impactor which provides both the fracture strength as well as fracture energy of impact. The test matrix consists of 5 solder alloys, 4 pad finishing, 3 thermal histories, and 2 solder mask designs forming a total of 120 combinations. The test has highlighted weakness in NSMD design and caution on SnAgCu solder when used in drop impact application
9
Effect of thermal aging on board level drop reliability for Pb-free BGA packages
Tz-Cheng Chiu, Kejun Zeng, R.J. Stierman et al. · 2004 · 248 citations
Drop impact survey of portable electronic products
Chwee Teck Lim, C.W. Ang, Long Bin Tan et al. · 2004 · 102 citations
Natural Sciences, Electrical Engineering, Mechanical Behavior Of Materials +16
Drop impact test - mechanics & physics of failure
E.H. Wong, Kian Meng Lim, N. Lee et al. · 2003 · 89 citations
Impact reliability of solder joints
Munehiro Date, T. Shoji, M. Fujiyoshi et al. · 2004 · 83 citations
Natural Sciences, Materials Engineering, Materials Science +17