E.H. Wong

DNA Sensing by Silicon Nanowire: Charge Layer Distance Dependence

Guojun Zhang, Gang Zhang, Jay Huiyi Chua et al. · Nano Letters · 2008 · 276 citations

The mechanics and impact of hygroscopic swelling of polymeric materials in electronic packaging

E.H. Wong, K.C. Chan, R. Rajoo et al. · 2002 · 145 citations

Engineering, Mechanical Engineering, Hygroscopic Swelling +20

Hygroscopic swelling and sorption characteristics of epoxy molding compounds used in electronic packaging

Haleh Ardebili, E.H. Wong, Michael Pecht · IEEE Transactions on Components and Packaging Technologies · 2003 · 138 citations

Materials Engineering, Materials Science, Chemical Engineering +13

The Mechanics and Impact of Hygroscopic Swelling of Polymeric Materials in Electronic Packaging

E.H. Wong, R. Rajoo, Sau Koh et al. · Journal of Electronic Packaging · 2002 · 120 citations

Engineering, Mechanical Engineering, Hygroscopic Swelling +18

Design features for bobbin friction stir welding tools: Development of a conceptual model linking the underlying physics to the production process

Kamil Sued, Dirk Pons, J Lavroff et al. · Materials & Design (1980-2015) · 2013 · 102 citations

Industrial Design, Design Features, Friction Welding +12