E.H. Wong

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Publications

Citations

3.3K

H-Index

Active since

1971

Affiliations

Institute of Microelectronics(Current)

Nanyang Technological University

National University of Singapore

Singapore Institute of Manufacturing Technology

Singapore Science Park

E.H. Wong is an author at Institute of Microelectronics specializing in materials engineering, materials science, and mechanical behavior of materials.

ORCID

Publications per year

1971–2019

Publications

The mechanics and impact of hygroscopic swelling of polymeric materials in electronic packaging

E.H. Wong, K.C. Chan, R. Rajoo et al. · 2002 · 146 citations

Natural Sciences, Materials Engineering, Materials Science +13

Hygroscopic swelling and sorption characteristics of epoxy molding compounds used in electronic packaging

Haleh Ardebili, E.H. Wong, Michael Pecht · IEEE Transactions on Components and Packaging Technologies · 2003 · 138 citations

Natural Sciences, Materials Engineering, Materials Science +17

The Mechanics and Impact of Hygroscopic Swelling of Polymeric Materials in Electronic Packaging

E.H. Wong, R. Rajoo, Sau Koh et al. · Journal of Electronic Packaging · 2002 · 120 citations

Natural Sciences, Materials Engineering, Materials Science +13

Design features for bobbin friction stir welding tools: Development of a conceptual model linking the underlying physics to the production process

Kamil Sued, Dirk Pons, J Lavroff et al. · Materials & Design (1980-2015) · 2013 · 102 citations · Full text

Engineering, Manufacturing Engineering, Mechanical Engineering +14

Drop impact survey of portable electronic products

Chwee Teck Lim, C.W. Ang, Long Bin Tan et al. · 2004 · 102 citations

Natural Sciences, Electrical Engineering, Mechanical Behavior Of Materials +16

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