Concepedia

Drop impact survey of portable electronic products

Chwee Teck Lim, C.W. Ang, Long Bin Tan, S.K.W. Seah, E.H. Wong

2004 · 102 citations · 4 references

Concepts

Natural SciencesElectrical EngineeringMechanical Behavior Of MaterialsPackaging DesignProduct DesignFailure AnalysisImpact BehaviorImpact DynamicsImpact MechanicsImpact ResistancePackaging EngineeringCommon Cause FailuresDrop Impact AnalysisDrop TestingExternal Component FailuresFailure Mechanisms Under ImpactImpact TestingMaterial Failure Under ImpactPersonal Digital Assistants

Abstract

Proceedings - Electronic Components and Technology Conference

References

4

Board level drop test and simulation of TFBGA packages for telecommunication applications

Tong Yan Tee, Hun Shen Ng, Chwee Teck Lim et al. · 2004 · 122 citations

Engineering, Computer Engineering, Materials Engineering +17

Investigating the drop impact of portable electronic products

Yin-Yi Low · 2003 · 89 citations

Engineering, Electrical Engineering, Mechanical Behavior Of Materials +16

Mechanical response of PCBs in portable electronic products during drop impact

S.K.W. Seah, Chwee Teck Lim, E.H. Wong et al. · 2003 · 55 citations

Natural Sciences, Electrical Engineering, Materials Science +17

Improving impact tolerance of portable electronic products: Case study of cellular phones

Shreya Goyal, Sanjay S. Upasani, Dhiren M. Patel · Experimental Mechanics · 1999 · 45 citations

Computing, Information Technology, Mobile Computing +13