Concepedia

Tong Yan Tee

TY

45

Publications

2K

Citations

25

H-Index

1999

Active since

Affiliations

STMicroelectronics (Singapore)(Current)

Nanyang Technological University

National University of Singapore

STMicroelectronics (Switzerland)

Amkor Technology (United States)

Tong Yan Tee is an author at STMicroelectronics (Singapore) specializing in engineering, electronic packaging, and reliability engineering.

Top concepts

EngineeringElectronic PackagingElectrical EngineeringMechanical EngineeringReliability EngineeringMechanics Of MaterialsMicroelectronicsComputer EngineeringStructural MechanicsReliability

Publications per year

1999–2011

45

Publications

45

Impact life prediction modeling of TFBGA packages under board level drop test

Tong Yan Tee, Hun Shen Ng, Chwee Teck Lim et al. · Microelectronics Reliability · 2004 · 192 citations

Reliability Engineering, Engineering, Life Prediction +8

Advanced experimental and simulation techniques for analysis of dynamic responses during drop impact

Tong Yan Tee, Jing-en Luan, E. Pek et al. · 2004 · 160 citations

Engineering, Impact (Mechanics), Structural Crashworthiness +25

Board level drop test and simulation of TFBGA packages for telecommunication applications

Tong Yan Tee, Hun Shen Ng, Chwee Teck Lim et al. · 2004 · 122 citations

Engineering, Impact (Mechanics), Impact Loading +16

Integrated vapor pressure, hygroswelling, and thermo-mechanical stress modeling of QFN package during reflow with interfacial fracture mechanics analysis

Tong Yan Tee, Z.W. Zhong · Microelectronics Reliability · 2003 · 115 citations

Materials Science, Qfn Package, Engineering +10

Modal analysis and dynamic responses of board level drop test

Jing-en Luan, Tong Yan Tee, E. Pek et al. · 2004 · 90 citations

Engineering, Comprehensive Dynamic Responses, Mechanical Engineering +17

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