Publication | Closed Access

Integrated vapor pressure, hygroswelling, and thermo-mechanical stress modeling of QFN package during reflow with interfacial fracture mechanics analysis

Materials ScienceQfn PackageEngineeringMechanical BehaviorMechanicsMechanical EngineeringVapor PressureThermo-mechanical Stress ModelingStressstrain AnalysisSolid MechanicsElectronic PackagingCrack FormationMechanics Of Materials