Integrated vapor pressure, hygroswelling, and thermo-mechanical stress modeling of QFN package during reflow with interfacial fracture mechanics analysis

Calculation of strain-energy release rates with higher order and singular finite elements

I. S. Raju · Engineering Fracture Mechanics · 1987 · 437 citations

Computing, Computational Engineering, Mechanical Engineering +16

Moisture Resistance Degradation of Plastic LSIs by Reflow Soldering

I. Fukuzawa, Susumu Ishiguro, Satoru Nanbu · Reliability physics · 1985 · 202 citations

Architecture, Materials Engineering, Materials Science +11

Moisture absorption and desorption predictions for plastic ball grid array packages

Jesse Galloway, B.M. Miles · IEEE Transactions on Components Packaging and Manufacturing Technology Part A · 1997 · 188 citations

Natural Sciences, Materials Engineering, Materials Science +15

Analysis of Package Cracking During Reflow Soldering Process

Makoto Kitano, A. Nishimura, Sueo KAWAI et al. · Reliability physics · 1988 · 181 citations

Engineering, Materials Engineering, Materials Science +9

The mechanics and impact of hygroscopic swelling of polymeric materials in electronic packaging

E.H. Wong, K.C. Chan, R. Rajoo et al. · 2002 · 146 citations

Natural Sciences, Materials Engineering, Materials Science +13