Impact life prediction modeling of TFBGA packages under board level drop test - Concepedia

Concepedia

Publication | Closed Access

Impact life prediction modeling of TFBGA packages under board level drop test

192

Citations

14

References

2004

Year

Tong Yan Tee, Hun Shen Ng, Chwee Teck Lim, E. Pek, Z.W. Zhong

Microelectronics Reliability

Reliability EngineeringEngineeringLife PredictionCivil EngineeringTfbga PackagesSystems EngineeringLife Cycle AssessmentReliability PredictionElectronic PackagingDeterioration ModelingService Life Prediction

References

	Year	Citations

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