Concepedia

Author

E. Pek

STMicroelectronics (Singapore)

Also Known As

E. Pek, Eric Pek

10

Publications

785

Citations

7

H-Index

23

Concepts

All Affiliations

STMicroelectronics (Singapore)Nanyang Technological UniversityNational University of Singapore
EP

About

E. Pek is an author at STMicroelectronics (Singapore) specializing in engineering, electronic packaging, and reliability engineering.

Top Concepts

#ConceptH-IndexPublicationsCitations

1

Engineering

7

7

776

2

Mechanical Engineering

6

6

584

3

Electrical Engineering

5

5

540

4

Civil Engineering

2

2

352

5

Computer Engineering

1

1

122

E. Pek

×

7

Publications

776

Citations

7

H-Index

YearCitations

Impact life prediction modeling of TFBGA packages under board level drop test

Tong Yan Tee, Hun Shen Ng, Chwee Teck Lim,

Microelectronics Reliability

2004

192

Advanced experimental and simulation techniques for analysis of dynamic responses during drop impact

Tong Yan Tee, Jing-en Luan, E. Pek,

2004

160

Board level drop test and simulation of TFBGA packages for telecommunication applications

Tong Yan Tee, Hun Shen Ng, Chwee Teck Lim,

2004

122

Modal analysis and dynamic responses of board level drop test

Jing-en Luan, Tong Yan Tee, E. Pek,

2004

90

Novel numerical and experimental analysis of dynamic responses under board level drop test

Tong Yan Tee, Jing-en Luan, E. Pek,

2004

89

Advanced Numerical and Experimental Techniques for Analysis of Dynamic Responses and Solder Joint Reliability During Drop Impact

Jing En Luan, Tong Yan Tee, E. Pek,

IEEE Transactions on Components and Packaging Technologies

2006

79

Dynamic responses and solder joint reliability under board level drop test

Jing-en Luan, Tong Yan Tee, E. Pek,

Microelectronics Reliability

2007

44

Page 1