Concepedia

E. Pek

EP

7

Publications

776

Citations

7

H-Index

2004

Active since

Affiliations

STMicroelectronics (Singapore)(Current)

Nanyang Technological University

National University of Singapore

E. Pek is an author at STMicroelectronics (Singapore) specializing in engineering, electronic packaging, and reliability engineering.

Top concepts

EngineeringElectronic PackagingMechanical EngineeringReliability EngineeringElectrical EngineeringStructural MechanicsMechanics Of MaterialsStructural Health MonitoringMechanicsReliability

Publications per year

2004–2007

7

Publications

7

Impact life prediction modeling of TFBGA packages under board level drop test

Tong Yan Tee, Hun Shen Ng, Chwee Teck Lim et al. · Microelectronics Reliability · 2004 · 192 citations

Reliability Engineering, Engineering, Life Prediction +8

Advanced experimental and simulation techniques for analysis of dynamic responses during drop impact

Tong Yan Tee, Jing-en Luan, E. Pek et al. · 2004 · 160 citations

Engineering, Impact (Mechanics), Structural Crashworthiness +25

Board level drop test and simulation of TFBGA packages for telecommunication applications

Tong Yan Tee, Hun Shen Ng, Chwee Teck Lim et al. · 2004 · 122 citations

Engineering, Impact (Mechanics), Impact Loading +16

Modal analysis and dynamic responses of board level drop test

Jing-en Luan, Tong Yan Tee, E. Pek et al. · 2004 · 90 citations

Engineering, Comprehensive Dynamic Responses, Mechanical Engineering +17

Novel numerical and experimental analysis of dynamic responses under board level drop test

Tong Yan Tee, Jing-en Luan, E. Pek et al. · 2004 · 89 citations

Engineering, Impact (Mechanics), Impact Loading +20

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