Hun Shen Ng - Concepedia

Author

Hun Shen Ng

STMicroelectronics (Singapore)

Also Known As

H.S Ng, H.S. Ng, HUN S. NG, Hun Shen Ng

Publications

784

Citations

H-Index

Concepts

All Affiliations

STMicroelectronics (Singapore)Nanyang Technological University National University of Singapore

About

Hun Shen Ng is an author at STMicroelectronics (Singapore) specializing in engineering, electronic packaging, and reliability engineering.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	13	14	742
2	Electrical Engineering	9	9	434
3	Computer Engineering	6	6	350
4	Civil Engineering	2	2	211
5	Applied Physics	1	1	31

Hun Shen Ng

Publications

742

Citations

H-Index

Page 1

	Year	Citations
Impact life prediction modeling of TFBGA packages under board level drop test Tong Yan Tee, Hun Shen Ng, Chwee Teck Lim, Microelectronics Reliability Reliability EngineeringEngineeringLife PredictionCivil EngineeringTfbga Packages	2004	192
Board level drop test and simulation of TFBGA packages for telecommunication applications Tong Yan Tee, Hun Shen Ng, Chwee Teck Lim, EngineeringImpact (Mechanics)Impact LoadingMechanical EngineeringTelecommunication Applications	2004	122
Board level solder joint reliability modeling and testing of TFBGA packages for telecommunication applications Tong Yan Tee, Hun Shen Ng, D. Yap, Microelectronics Reliability ReliabilityElectrical EngineeringReliability EngineeringTelecommunication ApplicationsEngineering	2003	82
Comprehensive board-level solder joint reliability modeling and testing of QFN and PowerQFN packages Tong Yan Tee, Hun Shen Ng, D. Yap, Microelectronics Reliability ReliabilityElectrical EngineeringReliability EngineeringEngineeringHardware Reliability	2003	52
Design for enhanced solder joint reliability of integrated passives device under board level drop test and thermal cycling test Tong Yan Tee, Hun Shen Ng, Z.W. Zhong EngineeringMechanical EngineeringReliability EngineeringAdvanced Packaging (Semiconductors)Electronic Packaging	2004	47
Development and application of innovational drop impact modeling techniques Tong Yan Tee, Jing-en Luan, Hun Shen Ng EngineeringImpact (Mechanics)Impact LoadingEnvironmental Impact AssessmentDrop Impact Model	2005	46
Drop impact life prediction model for lead-free BGA packages and modules Jing-en Luan, Tong Yan Tee, Kim Yong Goh, EngineeringLife PredictionDeterioration ModelingAdvanced Packaging (Semiconductors)Failure Analysis	2005	41
Board level solder joint reliability analysis of stacked die mixed flip-chip and wirebond BGA Tong Yan Tee, Hun Shen Ng, Z.W. Zhong Microelectronics Reliability Electrical EngineeringReliability EngineeringEngineeringChip-scale PackageAdvanced Packaging (Semiconductors)	2006	33
Whole field vapor pressure modeling of QFN during reflow with coupled hygro-mechanical and thermo-mechanical stresses Tong Yan Tee, Hun Shen Ng Moisture DiffusionEngineeringMechanical EngineeringVapor PressureThermal Processing	2003	31
Board-Level Solder Joint Reliability Analysis of Thermally Enhanced BGAs and LGAs Tong Yan Tee, Hun Shen Ng, Z.W. Zhong, IEEE Transactions on Advanced Packaging Heat SlugEngineeringMechanical EngineeringReliability EngineeringAdvanced Packaging (Semiconductors)	2006	24

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