Concepedia

Hun Shen Ng

HS

14

Publications

742

Citations

13

H-Index

2003

Active since

Affiliations

STMicroelectronics (Singapore)(Current)

Nanyang Technological University

National University of Singapore

Hun Shen Ng is an author at STMicroelectronics (Singapore) specializing in engineering, electronic packaging, and reliability engineering.

Top concepts

EngineeringElectronic PackagingElectrical EngineeringReliability EngineeringMechanical EngineeringSystems EngineeringComputer EngineeringReliabilityMicroelectronicsMechanics Of Materials

Publications per year

2003–2010

14

Publications

14

Impact life prediction modeling of TFBGA packages under board level drop test

Tong Yan Tee, Hun Shen Ng, Chwee Teck Lim et al. · Microelectronics Reliability · 2004 · 192 citations

Reliability Engineering, Engineering, Life Prediction +8

Board level drop test and simulation of TFBGA packages for telecommunication applications

Tong Yan Tee, Hun Shen Ng, Chwee Teck Lim et al. · 2004 · 122 citations

Engineering, Impact (Mechanics), Impact Loading +16

Board level solder joint reliability modeling and testing of TFBGA packages for telecommunication applications

Tong Yan Tee, Hun Shen Ng, D. Yap et al. · Microelectronics Reliability · 2003 · 82 citations

Reliability, Electrical Engineering, Reliability Engineering +10

Comprehensive board-level solder joint reliability modeling and testing of QFN and PowerQFN packages

Tong Yan Tee, Hun Shen Ng, D. Yap et al. · Microelectronics Reliability · 2003 · 52 citations

Reliability, Electrical Engineering, Reliability Engineering +9

Design for enhanced solder joint reliability of integrated passives device under board level drop test and thermal cycling test

Tong Yan Tee, Hun Shen Ng, Z.W. Zhong · 2004 · 47 citations

Engineering, Mechanical Engineering, Reliability Engineering +16

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