Comprehensive board-level solder joint reliability modeling and testing of QFN and PowerQFN packages - Concepedia

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Comprehensive board-level solder joint reliability modeling and testing of QFN and PowerQFN packages

52

Citations

9

References

2003

Year

Tong Yan Tee, Hun Shen Ng, D. Yap, Z.W. Zhong

Microelectronics Reliability

ReliabilityElectrical EngineeringReliability EngineeringEngineeringHardware ReliabilityReliability ModellingPowerqfn PackagesComputer EngineeringCircuit ReliabilitySystem ReliabilityReliability PredictionElectronic Packaging

References

	Year	Citations

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