Concepedia

Board level solder joint reliability modeling and testing of TFBGA packages for telecommunication applications

Tong Yan Tee, Hun Shen Ng, D. Yap, Xavier Baraton, Z.W. Zhong

Microelectronics Reliability · 2003 · 82 citations · 10 references

DOI

Concepts

References

10

Effect of simulation methodology on solder joint crack growth correlation

Robert Darveaux · 2002 · 535 citations

, , +17

Solder joint fatigue models: review and applicability to chip scale packages

W.W Lee, Luu Nguyen, Guna S Selvaduray · Microelectronics Reliability · 2000 · 507 citations

, , +11

Solder Joint Fatigue Life Model

Robert Darveaux · Medical Entomology and Zoology · 1997 · 187 citations

, , +5

Predicting solder joint reliability for thermal, power, and bend cycle within 25% accuracy

A. Syed · 2002 · 125 citations

, , +17

Implementation of and extensions to Darveaux's approach to finite-element simulation of BGA solder joint reliability

Z. Johnson · 2003 · 41 citations

, , +16