Xavier Baraton

Board level solder joint reliability modeling and testing of TFBGA packages for telecommunication applications

Tong Yan Tee, Hun Shen Ng, D. Yap et al. · Microelectronics Reliability · 2003 · 82 citations

Engineering, Computer Engineering, Packaging Design +11

Next generation eWLB (embedded wafer level BGA) packaging

Yonggang Jin, Xavier Baraton, Seung Wook Yoon et al. · 2010 · 72 citations

Engineering, Electrical Engineering, Packaging Design +16

Reliability assessment and hygroswelling modeling of FCBGA with no-flow underfill

Tong Yan Tee, Chek Lim Kho, D. Yap et al. · Microelectronics Reliability · 2003 · 53 citations

Engineering, Civil Engineering, Well Integrity +6

Drop impact life prediction model for lead-free BGA packages and modules

Jing-en Luan, Tong Yan Tee, Kim Yong Goh et al. · 2005 · 41 citations

Engineering, Computer Engineering, Materials Engineering +14

Mechanical characterization of next generation eWLB (embedded wafer level BGA) packaging

Seung Wook Yoon, Yaojian Lin, Sharma Gaurav et al. · 2011 · 32 citations

Engineering, Computer Engineering, Electrical Engineering +17