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STATS ChipPAC (Singapore)

SC

Statistics

Publications

305

Citations

5.4K

Authors

71

Location

Singapore, Singapore

STATS ChipPAC (Singapore) is a company institution in Singapore, Singapore known for engineering, semiconductor devices, and chip packaging.

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Publications

305

The Juvenile Salmon Acoustic Telemetry System: A New Tool

Geoffrey A. McMichael, M. Brad Eppard, Thomas J. Carlson et al. · Fisheries · 2010 · 238 citations

, , +13

Biosorption of copper(II) from aqueous solutions by pre-treated biomass of marine algae Padina sp.

Pairat Kaewsarn · Chemosphere · 2002 · 210 citations

, , +12

Fanout flipchip eWLB (embedded Wafer Level Ball Grid Array) technology as 2.5D packaging solutions

Seung Wook Yoon, Patrick Tang, Roger Emigh et al. · 2013 · 80 citations

, , +17

Next generation eWLB (embedded wafer level BGA) packaging

Yonggang Jin, Xavier Baraton, Seung Wook Yoon et al. · 2010 · 72 citations

, , +16

3D TSV processes and its assembly/packaging technology

Seung Wook Yoon, Dae Wook Yang, Jae Hoon Koo et al. · 2009 · 66 citations

, , +17

1–5 of 305

Authors

71

  1. YL
    Yaojian Lin

    STATS ChipPAC (Singapore), Singapore

    41 publications · 957 citations

    14

    h-index

  2. RP
    R. Pendse

    STATS ChipPAC (Singapore), Singapore

    34 publications · 328 citations

    11

    h-index

  3. FC
    Flynn Carson

    STATS ChipPAC (Singapore), Singapore

    31 publications · 370 citations

    11

    h-index

  4. PC
    Pandi C. Marimuthu

    STATS ChipPAC (Singapore), Singapore

    28 publications · 441 citations

    11

    h-index

  5. EO
    Eric Ouyang

    STATS ChipPAC (Singapore), Singapore

    25 publications · 355 citations

    9

    h-index

1–5 of 71