Pandi C. Marimuthu

Fanout flipchip eWLB (embedded Wafer Level Ball Grid Array) technology as 2.5D packaging solutions

Seung Wook Yoon, Patrick Tang, Roger Emigh et al. · 2013 · 80 citations

Engineering, Computer Engineering, Electrical Engineering +17

Next generation eWLB (embedded wafer level BGA) packaging

Yonggang Jin, Xavier Baraton, Seung Wook Yoon et al. · 2010 · 72 citations

Engineering, Electrical Engineering, Packaging Design +16

Advanced low profile PoP solution with embedded wafer level PoP (eWLB-PoP) technology

Seung Wook Yoon, Jose Alvin Caparas, Yaojian Lin et al. · 2012 · 59 citations

Engineering, Computer Engineering, Packaging Design +15

Fabrication and packaging of microbump interconnections for 3D TSV

Seung Wook Yoon, Jae Hoon Ku, Nathapong Suthiwongsunthorn et al. · 2009 · 39 citations

Engineering, Computer Engineering, Materials Engineering +14

Mechanical characterization of next generation eWLB (embedded wafer level BGA) packaging

Seung Wook Yoon, Yaojian Lin, Sharma Gaurav et al. · 2011 · 32 citations

Engineering, Computer Engineering, Electrical Engineering +17