Concepedia

Roger Emigh

RE

8

Publications

189

Citations

8

H-Index

2008

Active since

Affiliations

STATS ChipPAC (Singapore)(Current)

Roger Emigh is an author at STATS ChipPAC (Singapore) specializing in electrical engineering, microelectronics, and engineering.

Top concepts

EngineeringMicroelectronicsElectrical EngineeringComputer EngineeringElectronic PackagingAntennaComputer ArchitectureElectromagnetic CompatibilityReliabilityThermal Engineering

Publications per year

2008–2013

8

Publications

8

Fanout flipchip eWLB (embedded Wafer Level Ball Grid Array) technology as 2.5D packaging solutions

Seung Wook Yoon, Patrick Tang, Roger Emigh et al. · 2013 · 79 citations

Advanced Packaging, 3D Ic Architecture, Electrical Engineering +14

Band-pass-filter with balun function from IPD technology

Kai Liu, R.C. Frye, Roger Emigh · 2008 · 23 citations

Ipd Technology, Engineering, Electronic Design +16

Improvement of ELK Reliability in Flip Chip Packages using Bond-on-Lead (BOL) Interconnect Structure

Eric Ouyang, MyoungSu Chae, Seng Guan Chow et al. · IMAPSource Proceedings · 2010 · 22 citations · Full text

Interconnect Structure, Electrical Engineering, Chip-scale Package +15

Miniaturized ultra-wideband band-pass-filter from Silicon Integrated Passive Device technology

Kai Liu, R.C. Frye, Roger Emigh · 2009 · 19 citations

Electrical Engineering, Engineering, Smallest Uwb Filter +12

Thermal and electrical characterization of eWLB (embedded Wafer Level BGA)

Seung Wook Yoon, Roger Emigh, Kai Liu et al. · 2010 · 13 citations

Engineering, Computer Architecture, Wafer Scale Processing +16

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