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Redistribution Layers (RDLs) for 2.5D/3D IC Integration
John H. Lau, Pei-Jer Tzeng, C. Lee et al. · 2013 · 32 citations
A Study of Solder Joint Failure Criteria
Jianbiao Pan, Julie Silk · 2011 · 29 citations
Natural Sciences, Materials Engineering, Materials Science +17
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