Jianbiao Pan

The effect of reflow profile on SnPb and SnAgCu solder joint shear strength

Jianbiao Pan, Brian J. Toleno, Tzu‐Chien Chou et al. · Soldering and Surface Mount Technology · 2006 · 59 citations

Natural Sciences, Materials Engineering, Materials Science +11

Critical variables of solder paste stencil printing for micro-BGA and fine pitch QFP

Jianbiao Pan, Gregory L. Tonkay, Robert H. Storer et al. · 2003 · 52 citations

Engineering, Manufacturing Engineering, Materials Engineering +11

Effects of reflow profile and thermal conditioning on intermetallic compound thickness for SnAgCu soldered joints

Jianbiao Pan, Tzu‐Chien Chou, Jasbir Bath et al. · Soldering and Surface Mount Technology · 2009 · 41 citations

Natural Sciences, Materials Engineering, Materials Science +14

The Effect of Solder Joint Microstructure on the Drop Test Failure—A Peridynamic Analysis

Javad Mehrmashhadi, Yuye Tang, Xiaoliang Zhao et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2018 · 38 citations

Engineering, Materials Engineering, Materials Science +17

A Study of Solder Joint Failure Criteria

Jianbiao Pan, Julie Silk · IMAPSource Proceedings · 2011 · 29 citations

Natural Sciences, Materials Engineering, Materials Science +17