Jasbir Bath

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Publications

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Active since

2008

Affiliations

California Polytechnic State University(Current)

Flex (United States)

Henkel (Germany)

Henkel (United States)

Jasbir Bath is an author at California Polytechnic State University specializing in materials science, materials engineering, and chip-scale packaging.

Publications per year

2008–2009

Publications

Effects of reflow profile and thermal conditioning on intermetallic compound thickness for SnAgCu soldered joints

Jianbiao Pan, Tzu‐Chien Chou, Jasbir Bath et al. · Soldering and Surface Mount Technology · 2009 · 41 citations

Natural Sciences, Materials Engineering, Materials Science +14

Drop test reliability of lead-free chip scale packages

Andrew Farris, Jianbiao Pan, Albert A. Liddicoat et al. · 2008 · 28 citations

Engineering, Materials Engineering, Materials Science +17

Drop impact reliability of edge-bonded lead-free chip scale packages

Andrew Farris, Jianbiao Pan, Albert A. Liddicoat et al. · Microelectronics Reliability · 2009 · 13 citations

Engineering, Materials Engineering, Materials Science +13

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