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EngineeringMaterial ScienceMechanical EngineeringElectronic PackagingMicrostructureMechanics Of MaterialsMaterials EngineeringElectrical EngineeringAdvanced PackagingMicroelectronics
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1989–2026
2.7K
2.7K
Lead-Free Solder Interconnect Reliability
2005 · 199 citations
Lead‐free reflow soldering for electronics assembly
Martin Harrison, James H. Vincent, H. Steen · 2001 · 155 citations
Martin Goosey · 2010 · 130 citations
Viscoplastic Anand model for solder alloys and its application
Zhilin Cheng, G.Z. Wang, Lei Chen et al. · 2000 · 125 citations
Engineering, Severe Plastic Deformation, Mechanical Engineering +17
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