Brian J. Toleno

Publications

164

Citations

H-Index

2004

Active since

Affiliations

California Polytechnic State University(Current)

Henkel (United States)

Flex (United States)

Henkel (Germany)

Brian J. Toleno is an author at California Polytechnic State University specializing in engineering, mechanical engineering, and electronic packaging.

Top concepts

EngineeringMechanical EngineeringElectronic PackagingMaterial ScienceMicroelectronicsReliability EngineeringReliabilityElectrical EngineeringHigh Temperature MaterialsRheology

Publications per year

2004–2009

Publications

The effect of reflow profile on SnPb and SnAgCu solder joint shear strength

Jianbiao Pan, Brian J. Toleno, Tzu‐Chien Chou et al. · Soldering and Surface Mount Technology · 2006 · 58 citations

Materials Science, Reflow Peak Temperature, Engineering +8

Effects of reflow profile and thermal conditioning on intermetallic compound thickness for SnAgCu soldered joints

Jianbiao Pan, Tzu‐Chien Chou, Jasbir Bath et al. · Soldering and Surface Mount Technology · 2009 · 39 citations

Friction Welding, Engineering, Mechanical Engineering +20

Drop test reliability of lead-free chip scale packages

Andrew Farris, Jianbiao Pan, Albert A. Liddicoat et al. · 2008 · 28 citations

Engineering, Mechanical Engineering, Reliability Engineering +16

Processing and reliability of corner bonded CSPs

Brian J. Toleno, J. Schneider · 2004 · 15 citations

Engineering, Mechanical Engineering, Corner Bumps +17

Drop impact reliability of edge-bonded lead-free chip scale packages

Andrew Farris, Jianbiao Pan, Albert A. Liddicoat et al. · Microelectronics Reliability · 2009 · 13 citations

Reliability, Reliability Engineering, Engineering +7

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