Pei-Jer Tzeng - Concepedia

Author

Pei-Jer Tzeng

Industrial Technology Research Institute

Also Known As

P. Tzeng, Pei-Jer Tzeng, Pei-Jer Tzeng Pei-Jer Tzeng, Pei-jer Tzeng

Publications

Citations

H-Index

Concepts

All Affiliations

Industrial Technology Research Institute National Taiwan University National Tsing Hua University ITRI International Minghsin University of Science and Technology

About

Pei-Jer Tzeng is an author at Industrial Technology Research Institute specializing in engineering, microelectronics, and electrical engineering.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	17	24	786
2	Applied Physics	12	17	643
3	Computer Engineering	10	10	242
4	Chemical Engineering	3	3	43
5	Computer Science	1	1	19

Pei-Jer Tzeng

Publications

882

Citations

H-Index

Page 1

	Year	Citations
Low-Power Switching of Nonvolatile Resistive Memory Using Hafnium Oxide Heng-Yuan Lee, Pang-Shiu Chen, Ching‐Chiun Wang, Japanese Journal of Applied Physics Materials ScienceNon-volatile MemoryElectrical EngineeringElectronic DevicesEngineering	2007	171
An Ultrathin Forming-Free $\hbox{HfO}_{x}$ Resistance Memory With Excellent Electrical Performance Yu‐Sheng Chen, Heng-Yuan Lee, Pang-Shiu Chen, IEEE Electron Device Letters EngineeringEmerging Memory TechnologySolid-state ChemistryNanoelectronicsMemory Device	2010	135
$\hbox{HfO}_{x}$ Bipolar Resistive Memory With Robust Endurance Using AlCu as Buffer Electrode Heng Yuan Lee, Pang-Shiu Chen, Tai-Yuan Wu, IEEE Electron Device Letters Non-volatile MemoryEngineeringMemory DesignEmerging Memory TechnologyBipolar Resistive Memory	2009	58
Charge-Trapping-Type Flash Memory Device With Stacked High-$k$ Charge-Trapping Layer Ping-Hung Tsai, Kuei‐Shu Chang‐Liao, Te-Chiang Liu, IEEE Electron Device Letters SemiconductorsElectrical EngineeringElectronic DevicesEngineeringNanoelectronics	2009	41
Effects of etch rate on scallop of through-silicon vias (TSVs) in 200mm and 300mm wafers Yu-Chen Hsin, Chien‐Chou Chen, John H. Lau,	2011	38
Forming-free HfO<inf>2</inf> bipolar RRAM device with improved endurance and high speed operation Yu‐Sheng Chen, Tai-Yuan Wu, Pei-Jer Tzeng, Non-volatile MemoryEngineeringMemory DesignEmerging Memory TechnologyComputer Memory	2009	34
Characterization of the Ultrathin and Hf-Silicate Films Grown by Atomic Layer Deposition Tze Chiang Chen, Cheng-Yi Peng, Chih-Hung Tseng, IEEE Transactions on Electron Devices	2007	34
Redistribution Layers (RDLs) for 2.5D/3D IC Integration John H. Lau, Pei-Jer Tzeng, C. Lee, IMAPSource Proceedings EngineeringDevice IntegrationComputer ArchitectureRedistribution LayersInterconnect (Integrated Circuits)	2013	32
Process integration of 3D Si interposer with double-sided active chip attachments Pei-Jer Tzeng, John H. Lau, Chau‐Jie Zhan, Process IntegrationEngineeringDevice IntegrationPassive InterposerWafer Scale Processing	2013	24
Improving Edge Dead Domain and Endurance in Scaled HfZrO<sub>x</sub> FeRAM Yu-De Lin, Po‐Chun Yeh, Ying–Tsan Tang, 2021 IEEE International Electron Devices Meeting (IEDM) Materials ScienceDefect ToleranceElectrical EngineeringEdge InterfaceEngineering	2021	24

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