Concepedia

John H. Lau

JH

Statistics

Publications

251

Citations

10.2K

H-Index

50

Active since

1981

Affiliations

Industrial Technology Research Institute(Current)

Institute of Microelectronics

Agency for Science, Technology and Research

Hong Kong University of Science and Technology

Hewlett-Packard (United States)

John H. Lau is an author at Industrial Technology Research Institute specializing in engineering, chip packaging, and semiconductor devices.

Publications per year

1981–2025

251

Publications

251

Recent Advances and Trends in Advanced Packaging

John H. Lau · IEEE Transactions on Components Packaging and Manufacturing Technology · 2022 · 585 citations

Engineering, Electrical Engineering, Electronic Materials +15

Overview and outlook of through‐silicon via (TSV) and 3D integrations

John H. Lau · Microelectronics International · 2011 · 334 citations

Engineering, Computer Engineering, Electrical Engineering +17

Nonlinear Thermal Stress/Strain Analyses of Copper Filled TSV (Through Silicon Via) and Their Flip-Chip Microbumps

Cheryl Selvanayagam, John H. Lau, Xiaowu Zhang et al. · IEEE Transactions on Advanced Packaging · 2009 · 295 citations

Engineering, Materials Engineering, Materials Science +16

Solder Joint Reliability—Theory and Applications

John H. Lau, Peter A. Engel · Journal of Electronic Packaging · 1992 · 262 citations · Full text

Engineering, Manufacturing Engineering, Fault Tolerance +9

Thermal management of 3D IC integration with TSV (through silicon via)

John H. Lau, Tang Gong Yue · 2009 · 190 citations

Engineering, Materials Engineering, Computational Fluid Dynamics +16

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