John H. Lau - Concepedia

Author

John H. Lau

Industrial Technology Research Institute ORCID

Also Known As

J H Lau, J. H. Lau, J. H. W. Lau, J. LAU, J. Lau, J.H Lau, J.H. Lau, JOHN H. LAU, JOHN LAU, Jennifer Lau

577

Publications

13.5K

Citations

H-Index

182

Concepts

All Affiliations

Industrial Technology Research Institute Institute of Microelectronics Agency for Science, Technology and Research Hong Kong University of Science and Technology Hewlett-Packard (United States)

About

John H. Lau is an author at Industrial Technology Research Institute specializing in engineering, electronic packaging, and microelectronics.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	49	227	9.3K
2	Education	2	2	38
3	Natural Sciences	2	2	162
4	Medicine	1	1	90
5	Social Sciences	1	1	23

John H. Lau

250

Publications

9.9K

Citations

H-Index

Page 1

	Year	Citations
Recent Advances and Trends in Advanced Packaging John H. Lau IEEE Transactions on Components Packaging and Manufacturing Technology EngineeringOrdinary WlcspAdvanced Packaging (Semiconductors)Heterogeneous IntegrationElectronic Packaging	2022	503
Overview and outlook of through‐silicon via (TSV) and 3D integrations John H. Lau Microelectronics International EngineeringDevice IntegrationIc Integration SipIntegrated CircuitsInterconnect (Integrated Circuits)	2011	324
Nonlinear Thermal Stress/Strain Analyses of Copper Filled TSV (Through Silicon Via) and Their Flip-Chip Microbumps Cheryl Selvanayagam, John H. Lau, Xiaowu Zhang, IEEE Transactions on Advanced Packaging EngineeringMost TsvsThermal ExpansionThermal ConductivityFlip-chip Microbumps	2009	290
Solder Joint Reliability—Theory and Applications John H. Lau, Peter A. Engel Journal of Electronic Packaging ReliabilityReliability EngineeringEngineeringSolder Joint Reliability—theoryMechanical Engineering	1992	262
Thermal management of 3D IC integration with TSV (through silicon via) John H. Lau, Tang Gong Yue EngineeringStacked TsvAdvanced Packaging (Semiconductors)Transport PhenomenaIc Integration	2009	183
Evolution, challenge, and outlook of TSV, 3D IC integration and 3d silicon integration John H. Lau EngineeringDevice IntegrationComputer ArchitectureWafer Scale ProcessingAdvanced Packaging (Semiconductors)	2011	179
Thermal Stress and Strain in Microelectronics Packaging John H. Lau, Peter A. Engel Journal of Electronic Packaging Materials ScienceThermal StressChip-scale PackageEngineeringAdvanced Packaging (Semiconductors)	1993	175
TSV manufacturing yield and hidden costs for 3D IC integration John H. Lau EngineeringDevice IntegrationDigital ManufacturingComputer-aided DesignInterconnect (Integrated Circuits)	2010	148
Recent Advances and New Trends in Flip Chip Technology John H. Lau Journal of Electronic Packaging Electrical EngineeringFlip Chip TechnologyEngineeringChip-scale PackageAdvanced Packaging (Semiconductors)	2016	147
Warpage and Thermal Characterization of Fan-Out Wafer-Level Packaging John H. Lau, Ming Li, Dewen Tian, IEEE Transactions on Components Packaging and Manufacturing Technology Electrical EngineeringChip-scale PackageEngineeringAdvanced Packaging (Semiconductors)Wafer Scale Processing	2017	147

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