Concepedia

Tang Gong Yue

TG

3

Publications

319

Citations

3

H-Index

2009

Active since

Affiliations

Hong Kong University of Science and Technology(Current)

Tang Gong Yue is an author at Hong Kong University of Science and Technology specializing in engineering, thermal engineering, and heat transfer.

Top concepts

Publications per year

2009–2012

3

Publications

3

Thermal management of 3D IC integration with TSV (through silicon via)

John H. Lau, Tang Gong Yue · 2009 · 183 citations

, , +19

Effects of TSVs (through-silicon vias) on thermal performances of 3D IC integration system-in-package (SiP)

John H. Lau, Tang Gong Yue · Microelectronics Reliability · 2012 · 99 citations

, , +13

Effect of TSV interposer on the thermal performance of FCBGA package

Yen Yi Germaine Hoe, Tang Gong Yue, D. Pinjala et al. · 2009 · 37 citations

, , +17

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