D. Pinjala

Single-phase liquid cooled microchannel heat sink for electronic packages

Hengyun Zhang, D. Pinjala, Teck Neng Wong et al. · Applied Thermal Engineering · 2004 · 175 citations

Engineering, Liquid Metal Cooling, Microfabrication +7

Development of through silicon via (TSV) interposer technology for large die (21×21mm) fine-pitch Cu/low-k FCBGA package

Xiaowu Zhang, T.C. Chai, John H. Lau et al. · 2009 · 109 citations

Engineering, Computer Architecture, Large Die +17

Fabrication of High Aspect Ratio TSV and Assembly With Fine-Pitch Low-Cost Solder Microbump for Si Interposer Technology With High-Density Interconnects

Aibin Yu, John H. Lau, Soon Wee Ho et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 2011 · 65 citations

Engineering, Integrated Circuits, Interconnect (Integrated Circuits) +20

Thermal management of high power dissipation electronic packages: from air cooling to liquid cooling

Hengyun Zhang, D. Pinjala, Poi-Siong Teo · 2004 · 62 citations

Engineering, Liquid Metal Cooling, Energy Efficiency +19

TSV interposer fabrication for 3D IC packaging

Vempati Srinivasa Rao, Ho Soon Wee, Lee Wen Sheng Vincent et al. · 2009 · 61 citations

Engineering, Integrated Circuits, Interconnect (Integrated Circuits) +16