D. Pinjala - Concepedia

Author

D. Pinjala

Institute of Microelectronics

Also Known As

D Pinjala, D. Pinjala, Damaruganath Pinjala, P Damaruganath, P. Damaruganath, Pinjala Damaruganath

Publications

1.6K

Citations

H-Index

Concepts

All Affiliations

Institute of Microelectronics Agency for Science, Technology and Research Nanyang Technological University Singapore Science Park Hong Kong University of Science and Technology

About

D. Pinjala is an author at Institute of Microelectronics specializing in engineering, electronic packaging, and electrical engineering.

Top Concepts

#	Concept	H-Index	Publications	Citations
1	Engineering	19	36	1.3K
2	Electrical Engineering	17	24	885
3	Computer Engineering	14	14	506
4	Applied Physics	11	12	418
5	Biomedical Engineering	1	1	16

D. Pinjala

Publications

1.3K

Citations

H-Index

Page 1

	Year	Citations
Single-phase liquid cooled microchannel heat sink for electronic packages Hengyun Zhang, D. Pinjala, Teck Neng Wong, Applied Thermal Engineering EngineeringLiquid Metal CoolingMicrofabricationThermodynamicsElectronic Packaging	2004	175
Development of through silicon via (TSV) interposer technology for large die (21&#x00D7;21mm) fine-pitch Cu/low-k FCBGA package Xiaowu Zhang, T.C. Chai, John H. Lau, EngineeringComputer ArchitectureLarge DieInterconnect (Integrated Circuits)Advanced Packaging (Semiconductors)	2009	109
Fabrication of High Aspect Ratio TSV and Assembly With Fine-Pitch Low-Cost Solder Microbump for Si Interposer Technology With High-Density Interconnects Aibin Yu, John H. Lau, Soon Wee Ho, IEEE Transactions on Components Packaging and Manufacturing Technology EngineeringIntegrated CircuitsInterconnect (Integrated Circuits)Wafer Scale ProcessingAdvanced Packaging (Semiconductors)	2011	65
Thermal management of high power dissipation electronic packages: from air cooling to liquid cooling Hengyun Zhang, D. Pinjala, Poi-Siong Teo EngineeringLiquid Metal CoolingEnergy EfficiencyThermal Energy StoragePower Electronics	2004	62
TSV interposer fabrication for 3D IC packaging Vempati Srinivasa Rao, Ho Soon Wee, Lee Wen Sheng Vincent, EngineeringIntegrated CircuitsInterconnect (Integrated Circuits)Stack PackagingWafer Scale Processing	2009	61
3-D Packaging With Through-Silicon Via (TSV) for Electrical and Fluidic Interconnections Navas Khan, Li Yu, Tan Siow Pin, IEEE Transactions on Components Packaging and Manufacturing Technology EngineeringChip CarrierLiquid Metal Cooling3-D PackageFluidic Interconnections	2013	59
Integrated Liquid Cooling Systems for 3-D Stacked TSV Modules Gong Yue Tang, S. P. Tan, Navas Khan, IEEE Transactions on Components and Packaging Technologies 3D Ic ArchitectureEngineeringFluid PropertiesLiquid Metal CoolingMechanical Engineering	2010	58
Study of 15&#x00B5;m pitch solder microbumps for 3D IC integration Aibin Yu, John H. Lau, Soon Wee Ho, EngineeringUltra Fine PitchIntegrated CircuitsWafer Scale ProcessingAdvanced Packaging (Semiconductors)	2009	57
Development of liquid cooling techniques for flip chip ball grid array packages with High Heat flux dissipations Hengyun Zhang, D. Pinjala, Teck Neng Wong, IEEE Transactions on Components and Packaging Technologies EngineeringLiquid Metal CoolingHeat PipeSingle-phase LiquidRefrigeration	2005	54
Fluid flow and heat transfer in liquid cooled foam heat sinks for electronic packages Hengyun Zhang, D. Pinjala, Yogendra Joshi, IEEE Transactions on Components and Packaging Technologies EngineeringLiquid Metal CoolingFluid MechanicsMechanical EngineeringConvective Heat Transfer	2005	53

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